Amperage Determination

Abstract

In order that metal, especially copper, be plated to a desired thickness with an acceptable evenness and uniformity, the factors of current density must be thoroughly understood. As circuit density and complexity increase, and the tolerances of plated hole diameters decrease, the job of the plater becomes more difficult. Application of the understanding of current density and distribution will accomplish much more than mere attention to detail alone. A knowledge of the area to be plated and the recommended cathode current density of the plating bath is not sufficient to guarantee acceptability of the plating for printed circuits.