Abstract
Production of printed wiring assemblies (PWAs) free of detrimental residues requires consideration of the packaging technology selected, component designs, assembly layout, and the soldering, fluxing, and cleaning processes. Selection of the cleaning agent and process is itself dependent on the chemistry of the total material system. This includes solder, flux, substrate, solder mask, component, and marking materials as well as miscellaneous process materials and contaminants. This chapter will deal with the relationship of some of these design, material, and process issues and their impact on the cleanability of (and the need to clean) the manufactured PWA.
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© 1991 Van Nostrand Reinhold
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Hymes, L. (1991). Design and Process Considerations. In: Hymes, L. (eds) Cleaning Printed Wiring Assemblies in Today’s Environment. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-6967-7_1
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DOI: https://doi.org/10.1007/978-94-011-6967-7_1
Publisher Name: Springer, Dordrecht
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