Abstract
The residue which is left on or around a solder joint after reflowing solder paste is expected to be the mixture of ingredients in the flux/ vehicle portion of the paste, interreaction products among ingredients, and the reaction product between ingredients and substrate or solder alloy. Therefore, chemically, the residue is composed of polar organics, nonpolar organics, ionic salts, and metal salts of organics.
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© 1989 Van Nostrand Reinhold
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Hwang, J.S. (1989). Cleaning. In: Solder Paste in Electronics Packaging. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-6050-6_8
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DOI: https://doi.org/10.1007/978-94-011-6050-6_8
Publisher Name: Springer, Dordrecht
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