Abstract
This chapter covers the reflow methods currently available for reflowing solder paste. Literally, reflow is a misnomer; in the context of solder paste technology it means to flow or melt the paste, rather than to re-flow. Since it has been an accepted term in the solder paste field, „reflow“ will be used in this text. The reflow methods discussed here do not deal with wave soldering or other soldering techniques unrelated to the paste form.
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© 1989 Van Nostrand Reinhold
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Hwang, J.S. (1989). Soldering Methodologies. In: Solder Paste in Electronics Packaging. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-6050-6_7
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DOI: https://doi.org/10.1007/978-94-011-6050-6_7
Publisher Name: Springer, Dordrecht
Print ISBN: 978-94-011-6052-0
Online ISBN: 978-94-011-6050-6
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