Skip to main content
SpringerLink
Log in

Application Techniques

  • Chapter
Book cover Solder Paste in Electronics Packaging

  • 101 Accesses

Abstract

This chapter deals with the methodologies for consistently and accurately transferring solder paste onto the intended solder pads. Solder paste is endowed with characteristics that can be readily adapted to automation. The types of application methods include mesh screen printing, metal mask stencil printing, pneumatic dot and line dispensing, positive displacement dispensing, and pin transfer.

This is a preview of subscription content, log in via an institution to check access.

Access this chapter

Log in via an institution
Chapter
USD 29.95
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
eBook
USD 39.99
Price excludes VAT (USA)
  • Available as EPUB and PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book
USD 54.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Purchases are for personal use only

Institutional subscriptions

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

References

  1. AMI-Presco, North Branch, New Jersey.

    Google Scholar 

  2. TamasFreeska, “Stainless Steelvs. Polyester: Fabric Comparison for Electronics Printing,” SITE (Nov. 1986).

    Google Scholar 

  3. Utz Engineering, Inc., Clifton, New Jersey.

    Google Scholar 

  4. Dietrich E. Riemer, “Ink Hydrodynamics of Sheer Printing,” proceedings, 1985 International Hybrid Microelectronics Symposium, ISHM: 52.

    Google Scholar 

  5. Dietrich E. Riemer, “The Function and Performance of the Stainless Steel Screen During the Screen-Print Ink Transfer Process,” proceedings, 1986 International Hybrid Microelectronics Symposium, ISHM: 826.

    Google Scholar 

  6. Charles A. Harper, Handbook of Hybrid Microelectronics (New York: McGraw-Hill, 1974).

    Google Scholar 

  7. W. H. Herschel, “Experimental Investigations Upon the Flow of Liquid in Tubes of Very Small Diameter by J. L. M. Poiseuille,” Rheol. Met. Soc. of Rheology (1940).

    Google Scholar 

  8. W. H. McAdams, Heat Transmission (New York: McGraw-Hill, 1954).

    Google Scholar 

  9. Noel Peterson, “A Solder Paste Dispenser for SMD Assembly,” Surface Mount Technology, International Electronics Packaging Society 3–2: 989.

    Google Scholar 

  10. G. Blumb and K. Miller. SCM-Dispensit, Indianapolis, Indiana.

    Google Scholar 

  11. Robert M. Barto and Marc Peo, “Pin Transfer –Motions,” Circuits Manufacturing (Jun. 1987).

    Google Scholar 

Download references

Author information

Authors and Affiliations

  1. SCM Metal Products, Inc., USA

    Jennie S. Hwang Ph. D.

Authors
  1. Jennie S. Hwang Ph. D.
    View author publications

    You can also search for this author in PubMed Google Scholar

Rights and permissions

Reprints and permissions

Copyright information

© 1989 Van Nostrand Reinhold

About this chapter

Cite this chapter

Hwang, J.S. (1989). Application Techniques. In: Solder Paste in Electronics Packaging. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-6050-6_6

Download citation

  • DOI: https://doi.org/10.1007/978-94-011-6050-6_6

  • Publisher Name: Springer, Dordrecht

  • Print ISBN: 978-94-011-6052-0

  • Online ISBN: 978-94-011-6050-6

  • eBook Packages: Springer Book Archive

Publish with us

Policies and ethics

Search

Navigation