Abstract
Regarding chemical and physical characteristics of solder paste, the coverage in certain areas is inevitably discussed in general terms in order to avoid proprietary information.
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© 1989 Van Nostrand Reinhold
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Hwang, J.S. (1989). Chemical and Physical Characteristics. In: Solder Paste in Electronics Packaging. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-6050-6_3
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DOI: https://doi.org/10.1007/978-94-011-6050-6_3
Publisher Name: Springer, Dordrecht
Print ISBN: 978-94-011-6052-0
Online ISBN: 978-94-011-6050-6
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