Abstract
In the immense electronic materials world, solder paste is considered relatively minor in volume, yet it plays an important role in electronics packaging. Solder paste as a joining material, provides electrical, thermal, and mechanical functions in an electronics assembly. The performance and quality of solder paste are crucial to the integrity of a solder joint, which in turn is vital to the overall function of the assembly.
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© 1989 Van Nostrand Reinhold
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Hwang, J.S. (1989). Introduction. In: Solder Paste in Electronics Packaging. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-6050-6_1
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DOI: https://doi.org/10.1007/978-94-011-6050-6_1
Publisher Name: Springer, Dordrecht
Print ISBN: 978-94-011-6052-0
Online ISBN: 978-94-011-6050-6
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