Abstract
The determination of possible failure mechanisms and advance in reliability are essential aims in modern micro electronics. Thermal and mechanical strength cannot be avoided in technological processes and under use. In general, this leads to three dimensional stress and strain fields with concentrations at special locations, e.g. at interfaces, edges, or material imperfections. One reason is the thermal mismatch between several materials that are combined in a package.
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© 1997 Springer Science+Business Media Dordrecht
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Sommer, JP., Dudek, R., Michel, B., Boheim, M., Hager, W. (1997). Thermal and Mechanical Characterization of Electronic Packages in Extremely High Frequency Applications by Means of Finite Element Analysis. In: Beyne, E., Lasance, C.J.M., Berghmans, J. (eds) Thermal Management of Electronic Systems II. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-5506-9_34
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DOI: https://doi.org/10.1007/978-94-011-5506-9_34
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