Abstract
In this paper, a thermal and thermo-mechanical evaluation study of a new packaging approach, called CIMID (Chip in Moulded Interconnect Device), will be presented. The thermal performance of a prototype CIMID structure has been investigated by means of finite element analysis and experimental thermal characterisation techniques. Thermally induced stresses were calculated for a uniform cooling condition, which simulated the cooling down process after the encapsulation and curing process. The thermo-mechanical behaviour of the CIMID assembly was compared to those of a chip on PCB assembly.
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Beyne, E., Vanhoof, R., Christiaens, F., Roggen, J., Van Puymbroeck, J., Heerman, M., Gouwy, G., Bulcke, P.: “CIMID, a Technology for High Density Integration of Electronic Systems”, Proceedings of the 27th International Symposium on Microelectronics, ISHM 1994.
Funer, R.E., James, D.B.: “Advances in Thermoplastics for Electronic Applications”, in Polymers for Electronic and Photonic Applications, edited by Wong, C.P., Academic Press, Inc., San Diego, pp. 333–387, 1993.
Christiaens, F., Beyne, E., Temmernan, W., Allaert, K., Nelemans, W.: “Experimental Thermal Characterisation of Electronic Packages in a Fluid Bath Environment”, Proceedings EUROTHERM Seminar No 45, 1995.
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© 1997 Springer Science+Business Media Dordrecht
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Christiaens, F., Beyne, E., Roggen, J., van Puymbroeck, J., Heerman, M. (1997). Thermal and Thermo-Mechanical Evaluation of a ‘Chip in Moulded Interconnect Device’. In: Beyne, E., Lasance, C.J.M., Berghmans, J. (eds) Thermal Management of Electronic Systems II. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-5506-9_33
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DOI: https://doi.org/10.1007/978-94-011-5506-9_33
Publisher Name: Springer, Dordrecht
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