Abstract
The increase in speed and the reduction in size and weight of electronic components have resulted in the development of Multi-Chip-Module (MCM) technology in recent years. However, the increasing power density in such modules led to the need for thermal models of such electronic components. The Department of Technology has developed a Thermal-Model-Generator (TMG) for MCMs to provide thermal models. The numerical method implemented in the MCM-TMG software is based on physical representations of thermal flows and calculation of the associated thermal resistance.
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References
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© 1997 Springer Science+Business Media Dordrecht
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Belache, A., Gautier, T., Boisde, J.C., Leveau, N., Paulet, G. (1997). Thermal Characterisation and Modelling of Multichip Modules Using Standard Electronic Packages. In: Beyne, E., Lasance, C.J.M., Berghmans, J. (eds) Thermal Management of Electronic Systems II. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-5506-9_19
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DOI: https://doi.org/10.1007/978-94-011-5506-9_19
Publisher Name: Springer, Dordrecht
Print ISBN: 978-94-010-6318-0
Online ISBN: 978-94-011-5506-9
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