Abstract
Development and early use of Flip Chip Technology dates back in the 70s, when it was applied on ceramic substrates by a very limited number of Companies in computer by first and than in automotive systems.
This is a preview of subscription content, log in via an institution to check access.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 1998 Springer Science+Business Media Dordrecht
About this chapter
Cite this chapter
Cognetti, C. (1998). Flip Chip Technology: Is It Time of Mass Production?. In: Harman, G., Mach, P. (eds) Microelectronic Interconnections and Assembly. NATO ASI Series, vol 54. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-5135-1_8
Download citation
DOI: https://doi.org/10.1007/978-94-011-5135-1_8
Publisher Name: Springer, Dordrecht
Print ISBN: 978-94-010-6159-9
Online ISBN: 978-94-011-5135-1
eBook Packages: Springer Book Archive