Abstract
Thick film technologies using polymer materials as a conductors, resistors and insulations in several layers were enhanced into electronic production as a routine technology at the present time. Together with expansion of the PTF (Polymer Thick Film) technology a lot of the interconnections based on the polymer materials arise everyday. Becase the failures of these interconnections are the important part of the complete electronic device features, the reliability and electrical facilities of interconnections are one of the essential attributes of there.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 1998 Springer Science+Business Media Dordrecht
About this chapter
Cite this chapter
Urbančík, J. (1998). PTF (Polymer Thick Film) Interconnections in Term of Long Time Reliability. In: Harman, G., Mach, P. (eds) Microelectronic Interconnections and Assembly. NATO ASI Series, vol 54. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-5135-1_29
Download citation
DOI: https://doi.org/10.1007/978-94-011-5135-1_29
Publisher Name: Springer, Dordrecht
Print ISBN: 978-94-010-6159-9
Online ISBN: 978-94-011-5135-1
eBook Packages: Springer Book Archive