Abstract
The packaging of ICs for consumer electronics is dominated at present by single chip packaging. Developments of the past years in the single chip packaging field with to potential for miniaturisation in low cost consumer electronics are discussed. It turns out that the new developments as COB, TAB, BGA flip chip and chip size packages all have their limitations, partly from the package concept, partly from the printed circuit board technology. As a result it is expected that regular single chip packaging in the form of QFPs will remain mainstream for a long to come in this particular area.
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Literature
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© 1998 Springer Science+Business Media Dordrecht
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van Veen, C. (1998). IC Packaging for Miniaturised Consumer Electronics. In: Harman, G., Mach, P. (eds) Microelectronic Interconnections and Assembly. NATO ASI Series, vol 54. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-5135-1_2
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DOI: https://doi.org/10.1007/978-94-011-5135-1_2
Publisher Name: Springer, Dordrecht
Print ISBN: 978-94-010-6159-9
Online ISBN: 978-94-011-5135-1
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