Abstract
The use of copper conductive paste and copper laminates in manufacture of electronic circuits is getting wider and wider. It is stimulated both by economical and technical factors. The electric connections between semiconductor chips and substrates are usually realized by wire bonding. One of the most important problem, which must be solved properly is the suitable quality of bonds.
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References
“Badanie współpracy past i warstw przewodzgcych na bazie Cu z pastami i warstwami dielektrycznymi w ukladach wielowarstwowych”. Report from research work nr 773669203. OBR Kraków 1994
J.Gandurska, S.Nowak, I.Śniezyńska and al.
T.J.Green, R.G.Lausby, “Using DOE to Reduce Costs and Improve the Quality of Microelectronic Manufacturing Processes”. The ISHM International Journal of Microcircuits & Electronic Packaging No 3/1995
M. Sheaffer, L.R.Levine, B.Schlain, “Optimizing the Wire-Bonding Process for Copper Ball Bonding, Using Classic Experimental Designs” IEEE Transaction on Components, Hybrids and Manufacturing Technology, No 3, September 1987
T. A.Wassick, L. Economikos, “Open Repair Technologies for MCM-D”, IEEE Transactions for Components, Packaging and Manufacturing Technology, Part B: Advanced Packaging, No 1, February 1995
Ch.A.Harper, Handbook of Electronic Packaging, Mc Graw-Hill 1969
R.L. Shook, Thermosonic Wire Bonding on Single-layer Polymer Hybrid Integrated Circuits (POLYHICs), Hybrid Circuits No 13, May 1987
J.F.Haag, On the Resistance Increase of Gold-aluminium Wire Bonds, Hybrid Circuits No 26, September 1991.
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© 1998 Springer Science+Business Media Dordrecht
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Cież, M. (1998). Bonding of Al Wires to Copper Contacts on PCBs and Alumina Substrates - a Comparative Study. In: Harman, G., Mach, P. (eds) Microelectronic Interconnections and Assembly. NATO ASI Series, vol 54. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-5135-1_19
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DOI: https://doi.org/10.1007/978-94-011-5135-1_19
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