Abstract
In the first part a MCM-D switching unit specifically designed for performance analyses of thin-film interconnection substrates is described. The module consists of 4 unpacked 0.7-µm CMOS ASICs (100 I/O’s, 64 mm2, Standard-Cell technology) transmitting digital signals at 200 Mbit/s on a 5-layer thin-film substrate (1-by-1 inch, 2 interconnection layers).
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© 1998 Springer Science+Business Media Dordrecht
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Roggen, J., Beyne, E., Truzzi, C., Ringoot, E., Pieters, P. (1998). On Thin Film MCM-D Interconnects. In: Harman, G., Mach, P. (eds) Microelectronic Interconnections and Assembly. NATO ASI Series, vol 54. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-5135-1_16
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DOI: https://doi.org/10.1007/978-94-011-5135-1_16
Publisher Name: Springer, Dordrecht
Print ISBN: 978-94-010-6159-9
Online ISBN: 978-94-011-5135-1
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