Abstract
Flip chip mounting of bare dice is gaining widespread use in microelectronics packaging. The main drivers for this technology are high packaging density, improved performance at high frequency, low parasitics, potentially high reliability and low cost. Many companies have made significant efforts to develop technology for bump processing, bare die testing and underfill encapsulation to take the benefit of all potential advantages.
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© 1998 Springer Science+Business Media Dordrecht
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Annala, P., Kaitila, J., Salonen, J., Suni, I. (1998). Solder Bumping for Flip Chip Interconnections. In: Harman, G., Mach, P. (eds) Microelectronic Interconnections and Assembly. NATO ASI Series, vol 54. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-5135-1_11
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DOI: https://doi.org/10.1007/978-94-011-5135-1_11
Publisher Name: Springer, Dordrecht
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