Abstract
Electronics manufacturers are driven to produce new integrated circuits (IC’s) with higher quality in shorter production cycles (the well known time-to-market concept). In parallel, with the advent of submicron technologies digital circuits become more complex, with an increasing transistor-per-pin ratio making them hard-to-test without Design-For-Test (DFT) and Built-in Self-Test (BIST) facilities [1]. Also, during the past decade the production of mixed analog-digital IC’s have been dramatically developed due to the explosive growth of the multimedia and telecom markets and testing for quality assurance has proven to approach 50% of the manufacturing costs for some complex mixed-signal IC’s [2].
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References
M. Abramovici, M. A. Fridman and A. D. Brauer: Digital Systems Testing and Testable Design, IEEE Press, New-York, 1995
A. Grochowski, D. Bhattacharya, T. R. Viswanathan, K. Laker: Integrated Circuit Testing for Quality Assurance in Manufacturing: History, Current Status, and Future Trends, IEEE Transactions on Circuits and Systems-II Analog and Digital Signal Processing, Vol. 4, No 8, pp. 610, August 1997.
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© 1998 Springer Science+Business Media Dordrecht
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Bertrand, Y., Lorival, R., Robert, M., Cambon, G. (1998). Remote Education Experience on Learning IC Characterization/Production Test. In: Mouthaan, T.J., Salm, C. (eds) Microelectronics Education. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-5110-8_30
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DOI: https://doi.org/10.1007/978-94-011-5110-8_30
Publisher Name: Springer, Dordrecht
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