Abstract
The use of commercial aluminum alloys (T201, 2090 and 5052) plus an aluminum intermetallic phase (A13Ni) has been studied for thermally actuated MEMS. It was shown that strengthening mechanisms commonly employed in bulk Al alloys (solid solution strengthening, precipitation hardening and grain stabilization) can be used to increase the residual stress in bimetallic couple (Si and metal) by 50% to 400%. In addition, stress relaxation rates measured between 50°C and 350°C were dramatically lower for the commercial alloys up to 150°C. For A13Ti, no stress relaxation was detected even at 350°C. At least two mechanisms lead to stress relaxation, and the mechanism operating over times of <2 hours was suggested to be dynamic strain aging due to formation of precipitates. The second mechanism with a time constant of about 30 hours was speculated to be logarithmic creep. Oxidation was shown to change the stress in 2090 alloys at temperatures above 150°C.
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Holloway, P.H., Gorrell, J., Shannon, K. (1998). Stress in Thin Films for MEMS Actuators. In: Bhushan, B. (eds) Tribology Issues and Opportunities in MEMS. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-5050-7_37
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DOI: https://doi.org/10.1007/978-94-011-5050-7_37
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