Abstract
This paper reports a new method to fabricate in-plane oriented micro structures with use of an-isotropic wet chemical etching techniques. The method is very engaging due to the simplicity, low demands on cleanroom resources, the high accurate controllability and wafer-thickness independence. Integration in micro systems is facilitated by the unique possibility to obtain in-plane working devices. The functionality is demonstrated by performed analytical and numerical simulations as well as measurements of a duckbill valve.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
References
S. Shoji, M. Esashi, Microflow Devices and Systems, Journal of Micromechanics and Microengineering (4), pp. 157–171, 1994
M.C. Elwenspoek, T.S.J. Lammerink, R. Miyake, J.H.J. Fluitman, Towards integrated microliquid handling systems, Journal of Micromechanics and Microengineering (4), pp. 227–245, 1994
J.W. Berenschot, R.E. Oosterbroek, T.S.J. Lammerink and M.C. Elwenspoek, Micromachining of 111 plates in <001> oriented silicon, Journal of Micromechanics and Microengineering, March? 1998
H.T.G. van Lintel, F.C.M van de Pol, S. Bouwstra, A piezoelectric micropump based on micro-machining of silicon, Sensors and Actuators, 15, 1988, pp. 153–167
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 1998 Springer Science+Business Media Dordrecht
About this paper
Cite this paper
Oosterbroek, R.E., Berenschot, J.W., Schlautmann, S., Lammerink, T.S.J., van den Berg, A., Elwenspoek, M.C. (1998). A New Fabrication Method for In-Plane Micro Fluid Handling Components And Analysis Systems. In: van den Berg, A., Bergveld, P. (eds) Sensor Technology in the Netherlands: State of the Art. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-5010-1_13
Download citation
DOI: https://doi.org/10.1007/978-94-011-5010-1_13
Publisher Name: Springer, Dordrecht
Print ISBN: 978-94-010-6103-2
Online ISBN: 978-94-011-5010-1
eBook Packages: Springer Book Archive