Abstract
Amorphous dielectrics are key components of silicon devices. Silicon oxide, which has been used as the gate dielectric in MOS devices, is facing a number of challenges for deep sub-micron devices due to its low reliability because of electron and hole capturing, breakdown and boron penetration from poly-silicon. Silicon oxynitride (SiOXNy) will probably be used as the gate dielectric in the near future because of its boron blocking capabilities and higher reliability. Traps in SiOXNy determine the leakage current, breakdown and reliability. The nature of the traps still remains unclear.
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Gritsenko, V.A. (1998). Towards an Atomic Scale Understanding of Defects and Traps in Oxide/Nitride/Oxide and Oxynitride Systems. In: Garfunkel, E., Gusev, E., Vul’, A. (eds) Fundamental Aspects of Ultrathin Dielectrics on Si-based Devices. NATO Science Series, vol 47. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-5008-8_24
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DOI: https://doi.org/10.1007/978-94-011-5008-8_24
Publisher Name: Springer, Dordrecht
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