Abstract
Oxides, nitrides and oxynitrides are among the most important passivation layers of semiconductor surfaces and are generally grown through molecular (02, H20, N2, NH3, N20 or NO) interaction with the surface. The reaction could be promoted by surface electronic modification using e.g. a catalyst, by elevated temperatures, by photoreaction using unmonochromatized synchrotron radiation, or by surface structure modification. Some of the latest developments in low temperature ultrathin dielectric growth on representative silicon and silicon carbide surfaces are presented. Such important issues as interface formation, atomic scale initial and self-propagating oxidation, influence of surface structure and composition, role of defects, oxide/oxynitride stoichiometry, and reaction micromechanisms are addressed in this review article. The presented investigations are based on photoelectron spectroscopies using second and third generation synchrotron radiation light sources and atom-resolved scanning tunneling microscopy experiments.
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Soukiassian, P.G. (1998). Low Temperature Ultrathin Dielectrics on Silicon and Silicon Carbide Surfaces: From the Atomic Scale to Interface Formation. In: Garfunkel, E., Gusev, E., Vul’, A. (eds) Fundamental Aspects of Ultrathin Dielectrics on Si-based Devices. NATO Science Series, vol 47. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-5008-8_18
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DOI: https://doi.org/10.1007/978-94-011-5008-8_18
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