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Wafer Bonding for Micro-ElectroMechanical Systems (MEMS)

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Perspectives, Science and Technologies for Novel Silicon on Insulator Devices

Part of the book series: NATO Science Series ((ASHT,volume 73))

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Abstract

The wafer bonding technique was originally developed to produce SOI substrates, in which case hydrophilic oxide-to-oxide bonding is involved. Later on it became possible to bond other types of materials including bare (hydrogen terminated) silicon, compound semiconductors and nitride materials. Now wafer bonding is used to produce not only SOI substrates, but high-voltage silicon devices, optical devices, and micro-electromechanical systems. In this paper a review of the various processes for microfabrication of micro-electro-mechanical systems (MEMS) devices will reveal that silicon direct wafer (SDB) bonding combined with techniques such as bulk and surface micromachining, has added advantages for three-dimensional applications. We will report results showing that SDB can be used for the construction of complex structures. Furthermore, we will discuss the advantages of nitride bonding and present examples of practical applications utilizing this technique.

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Author information

Authors and Affiliations

  1. Dept. of Electrical and Electronic Engineering, California State University, 6000 J Street, Sacramento, California, 95819-6019, USA

    Cynthia A. Colinge

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  1. Cynthia A. Colinge
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Editor information

Editors and Affiliations

  1. University of Surrey, Guildford, Surrey, UK

    Peter L. F. Hemment

  2. Institute of Semiconductor Physics, Kyiv, Ukraine

    V. S. Lysenko  & A. N. Nazarov  & 

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© 2000 Springer Science+Business Media Dordrecht

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Colinge, C.A. (2000). Wafer Bonding for Micro-ElectroMechanical Systems (MEMS). In: Hemment, P.L.F., Lysenko, V.S., Nazarov, A.N. (eds) Perspectives, Science and Technologies for Novel Silicon on Insulator Devices. NATO Science Series, vol 73. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-4261-8_26

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  • DOI: https://doi.org/10.1007/978-94-011-4261-8_26

  • Publisher Name: Springer, Dordrecht

  • Print ISBN: 978-0-7923-6117-6

  • Online ISBN: 978-94-011-4261-8

  • eBook Packages: Springer Book Archive

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