Abstract
We have developed new electrolyte solutions for high voltage electrochemical oxidation of porous silicon and have demonstrated their utility by fabricating porous silicon structures containing a buried oxide layer. These structures have high breakdown voltages, over 300V, and are suitable for epitaxial growth of device grade silicon layers. These new structures provide the basis for a versatile SOI technology for the integration high speed and low power devices with high voltage power devices within a monolithic substrate. This paper complements technical details of a novel SOI technology described in the preceding paper in this volume.
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Romanov, S.I. et al. (2000). Characterization of Porous Silicon Layers Containing A Buried Oxide Layer. In: Hemment, P.L.F., Lysenko, V.S., Nazarov, A.N. (eds) Perspectives, Science and Technologies for Novel Silicon on Insulator Devices. NATO Science Series, vol 73. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-4261-8_18
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DOI: https://doi.org/10.1007/978-94-011-4261-8_18
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