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Grain Growth in Ultrafine-Grained Copper Processed by Severe Plastic Deformation

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Investigations and Applications of Severe Plastic Deformation

Part of the book series: NATO Science Series ((ASHT,volume 80))

Abstract

Grain growth in ultrafine-grained (UFG) copper during isothermal annealing and heating at a constant rate was studied by TEM, DSC and microhardness measurements. Three stages of thermal structure evolution in UFG copper were identified. These stages are connected with partial relaxation of the defects, migration of non-equilibrium grain boundaries and grain growth. The values of the activation energy in Stage II and Stage III were estimated.

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References

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Author information

Authors and Affiliations

  1. Institute of Physics of Advanced Materials, Ufa State Aviation Technical University, Ufa, Russia

    R. K. Islamgaliev & N. M. Amirkhanov

  2. Department of Materials Science and Engineering, Warsaw University of Technology, Warsaw, Poland

    K. J. Kurzydlowski & J. J. Bucki

Authors
  1. R. K. Islamgaliev
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  2. N. M. Amirkhanov
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  3. K. J. Kurzydlowski
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  4. J. J. Bucki
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Editor information

Editors and Affiliations

  1. Materials Science and Technology Division, Los Alamos National Laboratory, Los Alamos, NM, USA

    Terry C. Lowe

  2. Institute of Physics of Advanced Materials, Ufa State Aviation Technical University, Ufa, Russia

    Ruslan Z. Valiev

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© 2000 Springer Science+Business Media Dordrecht

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Islamgaliev, R.K., Amirkhanov, N.M., Kurzydlowski, K.J., Bucki, J.J. (2000). Grain Growth in Ultrafine-Grained Copper Processed by Severe Plastic Deformation. In: Lowe, T.C., Valiev, R.Z. (eds) Investigations and Applications of Severe Plastic Deformation. NATO Science Series, vol 80. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-4062-1_38

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  • DOI: https://doi.org/10.1007/978-94-011-4062-1_38

  • Publisher Name: Springer, Dordrecht

  • Print ISBN: 978-0-7923-6281-4

  • Online ISBN: 978-94-011-4062-1

  • eBook Packages: Springer Book Archive

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