Abstract
This paper presents thermal simulations of a semiconductor chip in a ceramic chip-carrier. This structure is modelled in a mixed environment, using a combination of conductive volumes, conductive layers and contact resistances. The boundary element method is used because this technique is more suited than any other numerical technique to implement the solution in such a mixed environment.
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© 1991 Computational Mechanics Publications
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Driscart, M., De Mey, G. (1991). Thermal Simulations of Semiconductor Chips Using BEM. In: Brebbia, C.A., Gipson, G.S. (eds) Boundary Elements XIII. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-3696-9_28
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DOI: https://doi.org/10.1007/978-94-011-3696-9_28
Publisher Name: Springer, Dordrecht
Print ISBN: 978-1-85166-696-6
Online ISBN: 978-94-011-3696-9
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