Abstract
Inconel 600/alumina joints have been prepared by hot uniaxial pressing. Comparison was made of the strength of the interfaces formed when joining directly In 600 to alumina or when inserting a Cu interlayer at the interface. Both tensile strength and fracture toughness (KIc) of the interfaces were tested. The toughness of the Cu-Al2O3 interface decreases sharply above 400°C whereas the In 600/Al2O3 interface keeps a KIc of 3.4 MPa.m1/2 at 700°C. A evaluation is made of the respective role of mechanical bonding and chemical bonding in the two systems.
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© 1991 Elsevier Science Publishers Ltd
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Tanghe, B., Evrard, O., Meynckens, J.P., Delannay, F. (1991). Diffusion Bonding Between Inconel 600 and Alumina. In: Grange, P., Delmon, B. (eds) Interfaces in New Materials. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-3680-8_19
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DOI: https://doi.org/10.1007/978-94-011-3680-8_19
Publisher Name: Springer, Dordrecht
Print ISBN: 978-1-85166-693-5
Online ISBN: 978-94-011-3680-8
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