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Interfaces in New Materials pp 190–199Cite as

Diffusion Bonding Between Inconel 600 and Alumina

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Abstract

Inconel 600/alumina joints have been prepared by hot uniaxial pressing. Comparison was made of the strength of the interfaces formed when joining directly In 600 to alumina or when inserting a Cu interlayer at the interface. Both tensile strength and fracture toughness (KIc) of the interfaces were tested. The toughness of the Cu-Al2O3 interface decreases sharply above 400°C whereas the In 600/Al2O3 interface keeps a KIc of 3.4 MPa.m1/2 at 700°C. A evaluation is made of the respective role of mechanical bonding and chemical bonding in the two systems.

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Author information

Authors and Affiliations

  1. Département des Sciences des Matériaux et des Procédés Center for Advanced Materials, PCPM, Université catholique de Louvain, Réaumur Place Sainte Barbe 2, B-1348, Louvain-la-Neuve, Belgium

    B. Tanghe, O. Evrard, J. P. Meynckens & F. Delannay

Authors
  1. B. Tanghe
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  2. O. Evrard
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  3. J. P. Meynckens
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  4. F. Delannay
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Editor information

Editors and Affiliations

  1. Unité de Catalyse et Chimie des Matériaux Divisés, Université Catholique de Louvain, Place Croix du Sud, 2/17, 1348, Louvain-La-Neuve, Belgium

    P. Grange  & B. Delmon  & 

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© 1991 Elsevier Science Publishers Ltd

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Tanghe, B., Evrard, O., Meynckens, J.P., Delannay, F. (1991). Diffusion Bonding Between Inconel 600 and Alumina. In: Grange, P., Delmon, B. (eds) Interfaces in New Materials. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-3680-8_19

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  • DOI: https://doi.org/10.1007/978-94-011-3680-8_19

  • Publisher Name: Springer, Dordrecht

  • Print ISBN: 978-1-85166-693-5

  • Online ISBN: 978-94-011-3680-8

  • eBook Packages: Springer Book Archive

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