Abstract
In the course of a general investigation of the particular case of the copper-alumina bonding Transmission Electron Microscopy (TEM) has been used to follow the interfacial reactions through a detailed characterization of compounds at the metal-ceramic interface.
Oxidized copper and alumina sheets have ben bonded using two procedures: solid state bonding and liquid state bonding by the eutectic method. As a consequence of these treatments, the binary oxide CuAlO2 is produced at the interface. This oxide shows a particular orientation with respect to the interface: the basal plane of its crystallographic structure is always laying parallel to the interface plane.
The microstructural defects of this intermediar oxide have been investigated. Dislocations and twins are present, they are running parallel to the basal plane. High resolution electron microscopy (HREM) shows that the twin plane and the glide plane coincide with a copper plane.
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Esnouf, C., Treheux, D. (1991). Pre-Oxidized Copper and Alumina Bonding. In: Grange, P., Delmon, B. (eds) Interfaces in New Materials. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-3680-8_17
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DOI: https://doi.org/10.1007/978-94-011-3680-8_17
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