Abstract
AA8090 superplastic sheet is now commercially available allowing the intrinsic low density of the alloy to be combined with the complexity of shape possible from superplastic forming routes. In order to take full advantage of this technology and produce lightweight expanded structures, a selective bonding technique is required which produces a joint with adequate room temperature strength and capable of withstanding the stresses associated with the superplastic forming operation. Such technology is established in the production of titanium alloy components but has been hampered in aluminium alloys due to the stability of the oxide layer always present on surfaces exposed to the atmosphere.
A variety of bonding techniques have been investigated including diffusion bonding, thin foil interlayer and roll clad zinc interlayer (transient liquid phase bonding) routes. Detailed metallographic data demonstrating bond line integrity is reported along with room temperature shear strengths and peel strengths measured at superplastic forming temperatures. It will be shown that diffusion bonding and solid state bonding with interlayers invariably produces oxide debris at the bond line which limits the strength of the bond. Successful bonds can be produced using transient liquid phase bonding, satisfying high and low temperature strength requirements, providing the correct combinations of boning technique and process parameters are used.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
References
D.V.Dunford and P.G.Partridge J. Mat. Sci. 22, (1987), 1790
P.G.Partridge and D.V.Dunford J. Mat. Sci. 22, (1987), 1597
D.Hauser, P.A.Kammer and J.H.Dedrick. Weld. Res. Sup. Jan. 1967. p11ff.
European patent appl. No 0 350 220
U.S. Patent No 4,732,312
J.Pilling and N.Ridley Mat. Sci. Tech. 3, 1987, 353.
U.K. Patent Appl. No 2,134,833
C.F.Knights, V.J.Moore, J.C.Riviere and L.S.Welch A.E.R.E. Harwell report No. G4060
E.R.Madrell, R.A.Ricks and E.R.Wallach Proc. 5th Int. Conf. Al-Li alloys, Williamsburg, VA. (1989) Eds. T.H.Sanders and E.A.Starke, p.451
T.Enjo, K.lkeuchi and K.Furukawa J. Jap. Inst. Light Met. July 1985, p.388
R.A.Ricks and N.C.Parson Proc. 5th Int. Conf. Al-Li alloys, Williamsburg, VA, (1989) Eds. T.H.Sanders and E.A.Starke, p.169
R.A.Ricks, P.-J.Winkler, H.Stoklossa and R.Grimes ibid. p.441
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 1991 Elsevier Science Publishers Ltd
About this chapter
Cite this chapter
Ricks, R.A., Mahon, G.J., Parson, N.C., Heinrich, T., Winkler, PJ. (1991). Development of Diffusion Bonding Techniques for Al-Li base Alloy AA8090. In: Stephenson, D.J. (eds) Diffusion Bonding 2. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-3674-7_7
Download citation
DOI: https://doi.org/10.1007/978-94-011-3674-7_7
Publisher Name: Springer, Dordrecht
Print ISBN: 978-1-85166-591-4
Online ISBN: 978-94-011-3674-7
eBook Packages: Springer Book Archive