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Development of Diffusion Bonding Techniques for Al-Li base Alloy AA8090

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Diffusion Bonding 2

Abstract

AA8090 superplastic sheet is now commercially available allowing the intrinsic low density of the alloy to be combined with the complexity of shape possible from superplastic forming routes. In order to take full advantage of this technology and produce lightweight expanded structures, a selective bonding technique is required which produces a joint with adequate room temperature strength and capable of withstanding the stresses associated with the superplastic forming operation. Such technology is established in the production of titanium alloy components but has been hampered in aluminium alloys due to the stability of the oxide layer always present on surfaces exposed to the atmosphere.

A variety of bonding techniques have been investigated including diffusion bonding, thin foil interlayer and roll clad zinc interlayer (transient liquid phase bonding) routes. Detailed metallographic data demonstrating bond line integrity is reported along with room temperature shear strengths and peel strengths measured at superplastic forming temperatures. It will be shown that diffusion bonding and solid state bonding with interlayers invariably produces oxide debris at the bond line which limits the strength of the bond. Successful bonds can be produced using transient liquid phase bonding, satisfying high and low temperature strength requirements, providing the correct combinations of boning technique and process parameters are used.

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References

  1. D.V.Dunford and P.G.Partridge J. Mat. Sci. 22, (1987), 1790

    Article  CAS  Google Scholar 

  2. P.G.Partridge and D.V.Dunford J. Mat. Sci. 22, (1987), 1597

    Article  CAS  Google Scholar 

  3. D.Hauser, P.A.Kammer and J.H.Dedrick. Weld. Res. Sup. Jan. 1967. p11ff.

    Google Scholar 

  4. European patent appl. No 0 350 220

    Google Scholar 

  5. U.S. Patent No 4,732,312

    Google Scholar 

  6. J.Pilling and N.Ridley Mat. Sci. Tech. 3, 1987, 353.

    CAS  Google Scholar 

  7. U.K. Patent Appl. No 2,134,833

    Google Scholar 

  8. C.F.Knights, V.J.Moore, J.C.Riviere and L.S.Welch A.E.R.E. Harwell report No. G4060

    Google Scholar 

  9. E.R.Madrell, R.A.Ricks and E.R.Wallach Proc. 5th Int. Conf. Al-Li alloys, Williamsburg, VA. (1989) Eds. T.H.Sanders and E.A.Starke, p.451

    Google Scholar 

  10. T.Enjo, K.lkeuchi and K.Furukawa J. Jap. Inst. Light Met. July 1985, p.388

    Google Scholar 

  11. R.A.Ricks and N.C.Parson Proc. 5th Int. Conf. Al-Li alloys, Williamsburg, VA, (1989) Eds. T.H.Sanders and E.A.Starke, p.169

    Google Scholar 

  12. R.A.Ricks, P.-J.Winkler, H.Stoklossa and R.Grimes ibid. p.441

    Google Scholar 

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© 1991 Elsevier Science Publishers Ltd

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Ricks, R.A., Mahon, G.J., Parson, N.C., Heinrich, T., Winkler, PJ. (1991). Development of Diffusion Bonding Techniques for Al-Li base Alloy AA8090. In: Stephenson, D.J. (eds) Diffusion Bonding 2. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-3674-7_7

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  • DOI: https://doi.org/10.1007/978-94-011-3674-7_7

  • Publisher Name: Springer, Dordrecht

  • Print ISBN: 978-1-85166-591-4

  • Online ISBN: 978-94-011-3674-7

  • eBook Packages: Springer Book Archive

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