Summary
Surface modification of 1.6 mm thick 8090 (Al-Li-Cu-Mg-Zr) sheet with silicon has been investigated using laser processing technology. An alloy which melts at about 550 °C has been produced and the laser parameters for production of shallow porosity-free tracks of this alloy in the sheet surface, with no distortion of the sheet, have been determined. Bonding trials at 560 °C have successfully joined two sheets together although on sectioning, evidence of solidification cracking was observed at the bond interface.
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© 1991 Crown Copyright
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Kamalu, J.N., McDarmaid, D.S. (1991). Laser Surface Modification of 8090 Alloy with Silicon for Diffusion Bonding. In: Stephenson, D.J. (eds) Diffusion Bonding 2. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-3674-7_11
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DOI: https://doi.org/10.1007/978-94-011-3674-7_11
Publisher Name: Springer, Dordrecht
Print ISBN: 978-1-85166-591-4
Online ISBN: 978-94-011-3674-7
eBook Packages: Springer Book Archive