Abstract
A tool based on the Boundary Element Method (B.E.M.) has been developed to model transmission lines on the Multichip Modules (MCM) for two-dimensional purposes. Both electrostatic field as well as eddy current problems are considered.
The tool is applied to model interconnects of a memory module fabricated in thin film technology in our research center.
For the electrostatic field the capacitance coefficients of a coplanar structure on the memory module are calculated and the results are compared to those obtained by the Finite Element Method. In the case of calculating conductor losses the results are compared to the measurements published in [1] for a single conductor embeded in a dielectric medium and to those from calculations based on F.E.M.
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© 1992 Computational Mechanics Publications
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Fazelpour, S., Dümcke, R., Reichl, H. (1992). Solution of Two-Dimensional Electrostatic and Eddy Current Problems Based on BEM for Modelling of Interconnects on Multichip Modules. In: Brebbia, C.A., Ingber, M.S. (eds) Boundary Element Technology VII. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-2872-8_21
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DOI: https://doi.org/10.1007/978-94-011-2872-8_21
Publisher Name: Springer, Dordrecht
Print ISBN: 978-1-85166-782-6
Online ISBN: 978-94-011-2872-8
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