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Cooling of Electronic Systems pp 97–122Cite as

Cooling Technology for High Performance Computers: IBM Sponsored University Research

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Part of the book series: NATO ASI Series ((NSSE,volume 258))

Abstract

This paper focuses on the role of university research in advancing basic heat transfer technology for application in cooling computers. Twenty-five years of IBM sponsored university research projects directed at enhancing heat transfer and establishing basic heat transfer data for application to computer cooling are summarized. Examples and results of research in heat transfer directed towards air and direct liquid immersion cooling applications are discussed.

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References

  1. Bar-Cohen, A., Kraus, A.D., and Davidson, S.F., Thermal Fronteirs in the Design and Packaging of Microelectronic Equipment,” Mechanical Engineering, pp. 53–59, Jun. 1983.

    Google Scholar 

  2. Sparrow, E.M., Niethammer, J.E., and Chaboki, A., Heat Transfer and Pressure Drop Characteristics of Arrays of Rectangular Modules Encountered in Electronic Equipment, Int. J. of Heat and Mass Transfer. Vol. 25, No. 7, pp. 961–972, Jul. 1982.

    Article  Google Scholar 

  3. Sparrow, E.M., Vemuri, S.B., and Kadle, D.S., Enhanced and Local Heat Transfer, Pressure Drop, and Flow Visualization for Arrays of Block-Like Electronic Components, Int. J. of Heat and Mass Transfer Vol. 26, No. 5, pp. 689–698, May 1983.

    Article  Google Scholar 

  4. Sparrow, E.M., Yanezmoreno, A.A., and Otis, D.R., Convective Heat Transfer Response to Height Differences in an Array of Block-Like Electronic Components,Int. J. of Heat and Mass Transfer. Vol. 27, No. 3, pp. 469–473, Mar. 1983.

    Article  Google Scholar 

  5. Chu, R.C., and Simons, R.E., Thermal Management of Large Scale Digital Computers,Intl. Jour. for Hybrid Microelectronics. Vol. 7, No. 3, pp. 35–43, Sep. 1984.

    Google Scholar 

  6. Hwang, U.P., Thermal Design Using Turbulators For Air-Cooled Electronic Modules on a Card Package, Proceedings of the National Electronic Packaging and Production Conference, pp. 441–449, Anaheim, CA, 1984.

    Google Scholar 

  7. Moffat, R.J., and Anderson, A., Applying Heat Transfer Data to Electronics Cooling, ASME HTD. Vol. 101, pp. 33–43, Nov. 1988.

    Google Scholar 

  8. Anderson, A., and Moffat, R.J., The Adiabatic Heat Transfer Coefficient and the Superposition Kernel Function: Part 1 -Data for Arrays of Flatpacks for Different Flow Conditions, ASME J. Elec. Packaging, Vol. 114, pp. 14–21, Mar. 1992.

    Article  Google Scholar 

  9. Anderson, A., and Moffat, R.J., The Adiabatic Heat Transfer Coefficient and the Superposition Kernel Function: Part 1 -Modeling Flatpack Data as a Function of Channel Turbulence, ASME J. Elec. Packaging, Vol. 114, pp. 24–28, Mar. 1992.

    Google Scholar 

  10. Anderson, A.M., and Moffat, R.J., Direct Air Cooling of Electronic Components: Reducing Component Temperatures by Controlled Thermal Mixing, ASME HTD-101. pp. 9–16, Nov. 1988.

    Google Scholar 

  11. Wirtz, R.A., and McAuliffe, W., Experimental Modeling of Convection Downstream From an Electronic Package Row, ASME J. Elec. Packaging. Vol. 111, pp. 207–212, Sep. 1989.

    Article  Google Scholar 

  12. Wirtz, R.A., and McAuliffe, W., Experimental Modeling of Convection Upstream from a Row of Electronic Packages, Proceedings of the 2nd InterSociety Conference on Thermal Phenomena in Electronic Systems, pp. 165–170, May 23–25, 1990.

    Chapter  Google Scholar 

  13. Wirtz, R.A., and Chen, W., Laminar-Transitional Convection From Repeated Ribs in a Channel, ASME J. Elec. Packaging. Vol. 114, pp. 29–34, Mar. 1992.

    Article  Google Scholar 

  14. Faghri, M., Lessmann, R.C., Sridhar, S., Schmidt, R., and Asako, Y., A Preliminary Experimental Study of Air Cooling of Rectangular Blocks Encountered in Electronic Equipment. ASME HTD. Vol. 123, pp. 1–6, 1989.

    Google Scholar 

  15. Sridhar, S., Faghri, M., Lessmann, R.C., and Schmidt, R., Heat Transfer Behavior Including Thermal Wake Effects in Forced Air Cooling of Arrays of Rectangular Blocks, ASME HTD-153. pp. 15–26, 1990.

    Google Scholar 

  16. Faghri, M., Ray, A., Sridhar, S., and Schmidt, R., Entrance Heat Transfer Correlation for Air Cooling of Arrays of Rectangular Blocks, ASME HTD-183. pp. 19–23, 1991.

    Google Scholar 

  17. Anderson, A., and Moffat, R.J., A Heat Transfer Correlation for Arbitrary Geometries in Electronic Equipment, ASME HTD. Vol. 53, pp. 27–40, 1990.

    Google Scholar 

  18. Hwang, U.P., and Simons, R.E., Dual-Pull Air Cooling for a Computer Frame, U.S. Patent 4.233.644. Nov. 1980.

    Google Scholar 

  19. Sparrow, E.M., Stryker, P.C., and Altemani, C.A., Heat Transfer and Pressure Drop in Flow Passages That are Open Along Their Lateral Edges, Int. J. of Heat and Mass Transfer. Vol. 28, No. 4, pp. 731–740, Apr. 1985.

    Article  Google Scholar 

  20. Sparrow, E.M., and Larson, E.D., Heat Transfer From Pin-Fins Situated in an Oncoming Longitudinal Flow Which Turns to Crossflow, Int. J. of Heat and Mass Transfer. Vol. 25, No. 5, pp. 603–614, May 1982.

    Article  Google Scholar 

  21. Larson, E.D., and Sparrow, E.M., “Performance Comparisons Among Geometrically Different Pin-Fin Arrays Situated in an Oncoming Longitudinal Flow, Int. J. of Heat and Mass Transfer. Vol. 25, No. 5, pp. 723–725, May 1982.

    Article  Google Scholar 

  22. Sparrow, E.M., Suopys, A.P., and Ansari, M.A., Effect of Inlet, Exit, and Fin Geometry on Pin Fins Situated in a Turning Flow, Int. J. of Heat and Mass Transfer. Vol. 27, No. 7, pp. 1039–1054, Jul. 1984.

    Article  Google Scholar 

  23. Oktay, S., Dessauer, B., and Horvath, J.L., New Internal and External Cooling Enhancements for the Air-Cooled IBM 4381 Module, presented at IEEE International Conference on Computer Design: VLSI in Computers, Port Chester, NY, Nov. 1983.

    Google Scholar 

  24. Biskeborn, R.G., Horvath, J.L., and Hultmark, E.B., Integral Cap Heat Sink Assembly for the IBM 4381 Processor, Proceedings of the National Electronic Packaging and Production Conference, pp. 468–474, Anaheim, CA, Oct. 29–31, 1984.

    Google Scholar 

  25. Timko, N., Blower Performance Enhancements in the 4381 Computer, Fourth Annual International Electronics Packaging Society (IEPS) Conference Proceedings.pp. 475–482, Oct. 1984.

    Google Scholar 

  26. Fitch, J.S., A One-Dimensional Thermal Model for the VAX 9000 Multi Chip Units, presented at ASME Winter Annual Meeting, Dallas, TX, 1990.

    Google Scholar 

  27. McPhee, J.M., O ’Toole. T.S., and Yedvabny, M., Cooling the VAX 9000, Electro/90 Conference Record, pp. 288–292, Boston, MA, May 9–11, 1990.

    Google Scholar 

  28. Gabuzda, P.G., Air Management System Yields High-Performance Cooling, Electronic Packaging and Production, pp. 64–65, May 1988.

    Google Scholar 

  29. Gabuzda, P.G., and Terrell, S.V., Directed air management system for cooling multiple heat sinks. U.S. Patent 4.851.965. Jul. 1989.

    Google Scholar 

  30. Gabuzda, P.G., Heat Sink Assembly for Encumbered IC Package, U.S. Patent 4.733.293. Mar. 1988

    Google Scholar 

  31. Hilbert, C., Sommerfeldt, S., Gupta, O., and Herrell, D.J., High Performance Micro-Channel Air Cooling, Proceedings of the 6th IEEE Semiconductor Thermal and Temperature Measurement Symposium, pp. 108–113, Phoenix, AZ, Feb. 6–8, 1990.

    Chapter  Google Scholar 

  32. Incropera, F.P., Kerby, J.S., Moffatt, D.F., and Ramadhyani, S., Convection Heat Transfer From Discrete Heat Sources in a Rectangular Channel, Int. J. Heat Mass Transfer. Vol. 29, No. 7, pp. 1051–1058, 1986.

    Article  Google Scholar 

  33. Ramadhyani, S., and Incropera, F.P., Forced Convection Cooling of Discrete Heat Sources With and Without Surface Enhancement, Proceedings of the International Symposium on Cooling Technology for Electronic Equipment, pp. 249–264, Honolulu, HI, Mar. 17–21, 1987.

    Google Scholar 

  34. Kelecy, F.J., Ramadhyani, S., and Incropera, F.P., Effect of Shrouded Pin Fins on Forced Convection Cooling of Discrete Heat Sources by Direct Liquid Immersion, Proceedings of the 2nd ASME-JSME Thermal Energy Joint Conference. Vol. 3, pp. 387–394, 1987.

    Google Scholar 

  35. Incropera, F.P., Liquid Immersion Cooling of Electronic Components, Heat Transfer in Electronic and Microelectronic Equipment. A.E. Bergles, ed., Hemisphere Publishing Company, New York, NY, 1990.

    Google Scholar 

  36. Moffatt, D.F., Ramadhyani, S., and Incropera, F.P., Conjugate Heat Transfer From Wall Embedded Sources in Turbulent Channel Flow, ASME HTD. Vol. 57, pp. 177–182, 1986.

    Google Scholar 

  37. Ramadhyani, S., Moffatt, D.F., and Incropera, F.P., Conjugate Heat Transfer From Small Isothermal Heat Sources Embedded in a Large Substrate, Int. J. Heat Mass Transfer. Vol. 28, No. 10, pp. 1945–1952, 1985.

    Article  Google Scholar 

  38. Heindl, T.J., Incropera, F.P., and Ramadhyani, S., Liquid Immersion Cooling of a Longitudinal Array of Discrete Heat Sources in Protuding Substrates: I -Single-Phase Convection, ASME J. Elec. Packaging. Vol. 114, pp. 55–62, Mar. 1992.

    Article  Google Scholar 

  39. Danielson, R.D., Krajewsi, N., and Brost, J., Cooling a Superfast Computer, Electronic Packaging and Production, pp. 44–45, Jul. 1986.

    Google Scholar 

  40. Cray, S.R., Immersion Cooled High Density Electronic Assembly, U.S. Patent 4.590.538. May 1986.

    Google Scholar 

  41. Aakalu, N.G., Chu, R.C., and Simons, R.E., Liquid Encapsulated Air Cooled Module, U.S. Patent 3.741.292. Jun. 1973.

    Google Scholar 

  42. Park, K.-A., and Bergles, A.E., Natural Convection Heat Transfer Characteristics of Simulated Microelectronic Chips, ASME J. Heat Transfer. Vol. 109, pp. 90–96, Feb. 1987.

    Article  Google Scholar 

  43. Park, K.-A., and Bergles, A.E., Ultrasonic Enhancement of Saturated and Subcooled Pool Boiling, Int. J. of Heat and Mass Transfer. Vol. 31, No. 3, pp. 664–667, Mar. 1988.

    Article  Google Scholar 

  44. Bergles, A.E., and Kim, C.-J., A Method to Reduce Temperature Overshoots in Immersion Cooling of Microelectronic Devices, Proceedings of the InterSocietv Conference on Thermal Phenomena in Electronic Components, pp. 100–105, Los Angeles, CA, May 11–13, 1988.

    Google Scholar 

  45. Carvalho, R.D., and Bergles, A.E., The Influence of Subcooling on the Pool Nucleate Boiling and Critical Heat Flux of Simulated Electronic Chips, Proc. of the 9th Intl. Heat Trans. Conf., pp. 289–294, 1990.

    Google Scholar 

  46. Park, K.-A., and Bergles, A.E., Effects of Size of Simulated Microelectronic Chips on Boiling and Critical Heat Flux, ASME HTD. Vol. 110, pp. 728–734, Aug. 1988.

    Google Scholar 

  47. Park, K.-A., and Bergles, A.E., Boiling Heat Transfer Characteristics of Simulated Microelectronic Chips with Detachable Heat Sinks, Proc. 8th Intl. Heat Transf. Conf., Vol.4, pp. 2099–2104, 1986.

    Google Scholar 

  48. Bergles, A.E., High Flux Boiling Applied to Microelectronics Thermal Control, Int. Comm. Heat Mass Transfer. Vol. 15, pp. 509–531, 1988.

    Article  Google Scholar 

  49. Anderson, T.M., and Mudawar, I., Microelectronic Cooling by Enhanced Pool Boiling of a Dielectric Fluorocarbon Liquid, J. Heat Transfer. Vol. 111, pp. 752–759, Aug. 1989.

    Article  Google Scholar 

  50. Mudawar, I., and Anderson, T.M., Parametric Investigation Into the Effects of Pressure, Subcooling, Surface Augmentation and Choice of Coolant on Pool Boiling in the Design of Cooling Systems for High-Power-Density Electronic Chips, ASME J. Elec. Packaging. Vol. 112, pp. 375–382, Dec. 1990.

    Article  Google Scholar 

  51. Mudawar, I., and Anderson, T.M., Optimization of Enhanced Surfaces for High Flux Chip Cooling by Pool Boiling, ASME J. Elec. Packaging. Vol. 115, pp. 89–100, Mar. 1993.

    Google Scholar 

  52. You, S.M., Simon, T.W., and Bar-Cohen, A., A Technique for enhancing Boiling Heat Transfer With Application to Cooling of Electronic Equipment, Proceedings of the 3rd Intersociety Conference on Thermal Phenomena in Electronic Systems. pp. 66–73, Austin, TX, Feb. 1992.

    Chapter  Google Scholar 

  53. Mudawar, I.A., Incropera, T.A., and Incropera, F.P., Microelectronic Cooling by Fluorocarbon Liquid Films, Proceedings of the International Symposium on Cooling Technology for Electronic Equipment, pp. 340–357, Honolulu, HI, Mar. 17–21, 1987.

    Google Scholar 

  54. Mudawar, I.A., Incropera, T.A., and Incropera, F.P., Boiling Heat Transfer and Critical Heat Flux in Liquid Films Falling on Vertically-Mounted Heat Sources. Int. J. Heat Mass Transfer. Vol. 30, No. 10, pp. 2083–2094, 1987.

    Article  Google Scholar 

  55. Grimley, T.A., Mudawar, I.A., and Incropera, F.P., Enhancement of Boiling Heat Transfer in Falling Films, Proceedings of the ASME/JSME Thermal Engineering Joint Conference. Vol. 3, pp. 411–418, 1987.

    Google Scholar 

  56. Grimley, T.A., Mudawar, I.A., and Incropera, F.P., Limits to Critical Heat Flux Enhancement in a Liquid Film Falling Over a Structured Surface That Simulates a Microelectronic Chip, J. Heat Transfer. Vol. 110, pp. 535–538, May 1988.

    Article  Google Scholar 

  57. Grimley, T.A., Mudawar, I.A., Incropera, F.P., CHF Enhancement in Flowing Fluorocarbon Liquid Films Using Structured Surfaces and Flow Deflectors,Int. J. Heat Mass Transfer. Vol. 31, No. 1, pp. 55–65, 1988.

    Article  Google Scholar 

  58. Hwang, U.P., and Moran, K.P., Boiling Heat Transfer of Silicon Integrated Circuits Chip Mounted on a Substrate, ASME HTD. Vol. 20, pp.53–59, 1981.

    Google Scholar 

  59. Maddox, D.E., and Mudawar, I., Single-and Two-Phase Convective Heat Transfer From Smooth and Enhanced Microelectronic Heat Sources in a Rectangular Channel, J. Heat Transfer. Vol. 111, pp. 1045–1052, Nov. 1989.

    Article  Google Scholar 

  60. Mudawar, I., and Maddox, D.E., Critical Heat Flux in Subcooled Flow Boiling of Fluorocarbon Liquid on a Simulated Electronic Chip in a Vertical Rectangular Channel, Int. J. Heat Mass Transfer, Vol. 32, No. 2, pp. 379–394, 1989.

    Article  Google Scholar 

  61. Mudawar, I., and Maddox, D.E., Enhancement of Critical Heat Flux From High Power Microelectronic Heat Sources in a Flow Channel, ASME J. Elec. Packaging.Vol. 112, pp. 241–248, Sep. 1990.

    Article  Google Scholar 

  62. Heindl, T.J., Ramadhyani, S., and Incropera, F.P., Liquid Immersion Cooling of a Longitudinal Array of Discrete Heat Sources in Protruding Substrates: II -Forced Convection Boiling, ASME J. Elec. Packaging, Vol. 114, pp. 63–70, Mar. 1992.

    Article  Google Scholar 

  63. Strom, B.D., Carey, V.P., and McGillis, W.R., An Experimental Investigation of the Critical Heat Flux Conditions for Subcooled Convective Boiling From an Array of Simulated Microelectronic Devices, ASME HTD. Vol. 111, pp. 135–142, 1989.

    Article  Google Scholar 

  64. McGillis, W.R., Carey, V.P., and Strom, B.D., Geometry Effects on Critical Heat Flux for Subcooled Convective Boiling From an Array of Heated Elements, ASME J. Elec. Packaging. Vol. 113, pp. 463–471, May, 1991.

    Google Scholar 

  65. Ma, C.-F., and Bergles, A.E., Boiling Jet Impingement of Simulated Microelectronic Chips, ASME HTD. Vol.28, pp. 5–12, 1983.

    Google Scholar 

  66. Jiji, L., and Dagan, Z., Experimental Investigation of Single Phase Multi Jet Impingement Cooling of an Array of Microelectronic Heat Sources, Modern Developments in Cooling Technology for Electronic Equipment, W. Aung, ed.,pp. 265–283, Hemisphere Publishing Corp., New York, NY, 1988.

    Google Scholar 

  67. Sullivan, P.F., Ramadhyani, S., and Incropera, F.P., Use of Smooth and Roughened Spreader Plates to Enhance Impingement Cooling of Small Heat Sources With Single Circular Liquid Jets, ASME HTD. Vol. 206-2, pp. 103–110, Aug. 1992.

    Google Scholar 

  68. Sullivan, P.F., Ramadhyani, S., and Incropera, F.P., Extended Surfaces to Enhance Impingement Cooling with Single Circular Jets, Advances in Electronic Packaging. ASME EEP-Vol. 1, pp. 207–215, Apr. 1992.

    Google Scholar 

  69. Nonn, T., Dagan, Z., and Jiji, L.M., Boiling Jet Impingement Cooling of Simulated Microelectronic Heat Sources, ASME Paper 88-WA/EEP-3 , Dec. 1988.

    Google Scholar 

  70. Nonn, T., Dagan, Z., and Jiji, L., Jet Impingement Row Boiling of a Mixture of FC-72 and FC-87 Liquids on a Simulated Electronic Chip, ASME HTD-111. pp. 121–128, 1989.

    Google Scholar 

  71. Chrysler, G.M., Personal communication, 1993.

    Google Scholar 

  72. Sperry, C., Claybaker, P., Cree, R., Gill, J., Ing, P., Philstrom, R., and Webster, J., SS-1 Supercomputer Cooling System, Proceedings of the 43rd Electronic Components and Technology Conference. Orlando, FL, Jun. 1–4, 1993.

    Google Scholar 

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Author information

Authors and Affiliations

  1. Mid-Hudson Valley Laboratory Enterprise Systems, IBM Corporation, Poughkeepsie, NY, 12602, USA

    R. C. Chu & R. E. Simons

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  1. R. C. Chu
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  2. R. E. Simons
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Editor information

Editors and Affiliations

  1. University of Miami, Coral Gables, Florida, USA

    S. Kakaç

  2. Middle East Technical University, Ankara, Turkey

    H. Yüncü

  3. Tokyo Institute of Technology, Tokyo, Japan

    K. Hijikata

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© 1994 Springer Science+Business Media Dordrecht

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Chu, R.C., Simons, R.E. (1994). Cooling Technology for High Performance Computers: IBM Sponsored University Research. In: Kakaç, S., Yüncü, H., Hijikata, K. (eds) Cooling of Electronic Systems. NATO ASI Series, vol 258. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-1090-7_5

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  • DOI: https://doi.org/10.1007/978-94-011-1090-7_5

  • Publisher Name: Springer, Dordrecht

  • Print ISBN: 978-94-010-4476-9

  • Online ISBN: 978-94-011-1090-7

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