Abstract
Thermal resistances offered by solid-to-solid contacts assume high significance because of the high temperature drops which occur at such interfaces, especially when high density heat fluxes are encountered. The process of heat transfer across an interface is a very complex problem, and needs to be determined in order to accurately evaluate the overall thermal performance of various systems. The objective of this article is to present the physical mechanisms, and methods of prediction of thermal contact resistance for various metallic interfaces. A review of published theoretical analyses and experimental investigations is summarized. The theories which resulted in some successful correlations between analytical studies and experimental data are presented and analyzed. Recent progress in the understanding and solving the thermal contact resistance in electrical packages is also briefly reviewed.
Keywords
- Heat Transfer
- Contact Pressure
- Contact Resistance
- Effective Thermal Conductivity
- Thermal Contact Resistance
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.
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Yüncü, H., Kakaç, S. (1994). Thermal Contact Conductance - Theory and Applications. In: Kakaç, S., Yüncü, H., Hijikata, K. (eds) Cooling of Electronic Systems. NATO ASI Series, vol 258. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-1090-7_26
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DOI: https://doi.org/10.1007/978-94-011-1090-7_26
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