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Cooling of Electronic Systems pp 507–537Cite as

Application of Channel Flows to Single-Phase Liquid Cooling of Chips and Multi-Chip Modules

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Part of the book series: NATO ASI Series ((NSSE,volume 258))

Abstract

By virtue of their compatibility with conventional packaging schemes, channel flows are well suited for cooling planar, multi-chip arrays. For example, chips may be mounted on one (or more) walls of a rectangular channel, while cooling is provided by flow of a liquid through the channel. Alternatively, cooling may be provided by microchannels manufactured in the chip itself. This paper focuses primarily on hydrodynamic and thermal conditions associated with liquid flow through a rectangular channel for which one wall houses an array of chips. Both single-phase mixed and forced convection cooling are considered, as are the benefits to be derived from using extended surfaces for heat transfer enhancement. Existing results provide a useful knowledge base for cooling system design, and depending on the Reynolds number, single-phase channel flows may be used to dissipate chip heat fluxes over a range from approximately 2 to 100 W/cm2. Consideration is also given to flow conditions associated with microchannels and their applicability to electronic cooling.

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Author information

Authors and Affiliations

  1. Heat Transfer Laboratory School of Mechanical Engineering, Purdue University, West Lafayette, Indiana, 47907, USA

    F. P. Incropera & S. Ramadhyani

Authors
  1. F. P. Incropera
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  2. S. Ramadhyani
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Editor information

Editors and Affiliations

  1. University of Miami, Coral Gables, Florida, USA

    S. Kakaç

  2. Middle East Technical University, Ankara, Turkey

    H. Yüncü

  3. Tokyo Institute of Technology, Tokyo, Japan

    K. Hijikata

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© 1994 Springer Science+Business Media Dordrecht

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Incropera, F.P., Ramadhyani, S. (1994). Application of Channel Flows to Single-Phase Liquid Cooling of Chips and Multi-Chip Modules. In: Kakaç, S., Yüncü, H., Hijikata, K. (eds) Cooling of Electronic Systems. NATO ASI Series, vol 258. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-1090-7_22

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  • DOI: https://doi.org/10.1007/978-94-011-1090-7_22

  • Publisher Name: Springer, Dordrecht

  • Print ISBN: 978-94-010-4476-9

  • Online ISBN: 978-94-011-1090-7

  • eBook Packages: Springer Book Archive

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