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Single-Phase, Liquid Jet Impingement Cooling of High-Performance Chips

  • Chapter
Cooling of Electronic Systems

Part of the book series: NATO ASI Series ((NSSE,volume 258))

Abstract

For computer chips configured in isolation or as part of an array, a consistent trend has been one of progressively increasing power dissipation. In many applications chip heat fluxes are approaching 100 W/cm2, and it is not unlikely that fluxes of 200 W/cm2 will be realized before the turn of the century. One of the most promising options for dissipating such heat fluxes, while maintaining chip surface temperatures at acceptable levels, involves single phase convection cooling via liquid jet impingement. By eliminating intervening conduction resistances between the chip and the liquid and by providing highly effective convection cooling at the chip surface, chip-to-coolant thermal resistances as low as 0.3°C·cm2/W may be achieved using a dielectric liquid with a modest coolant flowrate of 1 1pm. After considering pertinent hydrodynamic conditions for both free-surface and submerged jets, this paper reviews the results of heat transfer studies which have been performed for simulated chip conditions. The review considers both circular and rectangular (slot) jets, single and multiple chip configurations, the use of extended surfaces for heat transfer enhancement, and the effects of jet confinement and outflow conditions. The results confirm the suitability of using impinging liquid jets for high performance cooling and provide a useful knowledge base for cooling system design.

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Authors and Affiliations

  1. Heat Transfer Laboratory, School of Mechanical Engineering, Purdue University, W. Lafayette, IN, 47907, USA

    F. P. Incropera & S. Ramadhyani

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  1. F. P. Incropera
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  2. S. Ramadhyani
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Editors and Affiliations

  1. University of Miami, Coral Gables, Florida, USA

    S. Kakaç

  2. Middle East Technical University, Ankara, Turkey

    H. Yüncü

  3. Tokyo Institute of Technology, Tokyo, Japan

    K. Hijikata

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Incropera, F.P., Ramadhyani, S. (1994). Single-Phase, Liquid Jet Impingement Cooling of High-Performance Chips. In: Kakaç, S., Yüncü, H., Hijikata, K. (eds) Cooling of Electronic Systems. NATO ASI Series, vol 258. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-1090-7_21

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  • DOI: https://doi.org/10.1007/978-94-011-1090-7_21

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