Abstract
The incessant drive toward higher quality, functional density, and speed, in nearly all categories of electronic equipment, is severely constrained by the available packaging technology. The packaging of high-performance electronic systems is highly interdisciplinary and succeeds best when pursued systematically, with attention to both constraints and technological alternatives, as well as opportunities for component and system optimization. The development of a science-based physical design methodology for electronic systems constitutes the primary packaging challenge for the 1990s.
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© 1994 Springer Science+Business Media Dordrecht
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Bar-Cohen, A. (1994). Trends in the Packaging of Computer Systems. In: Kakaç, S., Yüncü, H., Hijikata, K. (eds) Cooling of Electronic Systems. NATO ASI Series, vol 258. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-1090-7_2
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DOI: https://doi.org/10.1007/978-94-011-1090-7_2
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