Abstract
Flat rectangular plate heat sinks are often used to cool large electronic components by the combined effects of natural convection and thermal radiation. There is, however, a paucity of rational design techniques for these devices. Thus, a systematic program to investigate the use of flat, rectangular plate heat sinks with surface coatings to enhance the net radiative exchange with the surroundings has been undertaken.
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References
Patankar, S.V., 1978, “A Numerical Method For Conduction In Composite Materials, Flow In Irregular Geometries And Conjugate Heat Transfer, Proc. 6th Int. Heat Transf. Conf., Toronto, Vol.3, p. 297.
Patankar, S.V., 1980, Numerical Heat Transfer And Fluid Flow, Hemisphere Publishing Corp., Washington, McGraw-Hill Book Co., N.Y.
Siegel, R., and Howell, J. R., 1972, Thermal Radiation Heat Transfer, McGraw-Hill Book Company, New York, pp. 204–207.
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© 1994 Springer Science+Business Media Dordrecht
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Krane, R.J., Ahmed, I., Parsons, J.R. (1994). The Cooling of Electronic Components with Flat Plate Heat Sinks. In: Kakaç, S., Yüncü, H., Hijikata, K. (eds) Cooling of Electronic Systems. NATO ASI Series, vol 258. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-1090-7_19
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DOI: https://doi.org/10.1007/978-94-011-1090-7_19
Publisher Name: Springer, Dordrecht
Print ISBN: 978-94-010-4476-9
Online ISBN: 978-94-011-1090-7
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