Abstract
Thermal performance is one of the most important criterion in the material and process selection for microelectronic packages. Thermal management is driven by integrated circuit scaling. So, forced-air cooling is not only way to get the heat out of electronics. In this paper, cooling of electronic components by impinging air jets is introduced. Use of impinging air to enhance heat and mass transfer rates is relatively new development in heating, cooling, and drying operations in industry. In industrial applications such as cooling of high energy density electronic components, where highly localized cooling is desired, a single or a row of widely spaced jets is usually used. This paper also introduces advanced methods of cooling of electronic systems and comparison has been given for different cooling methods. Also, it goes on to explain basic principles of new cooling methods.
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© 1994 Springer Science+Business Media Dordrecht
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Can, M., Pulat, E. (1994). Cooling of Electronic Systems by Impinging Air Jets. In: Kakaç, S., Yüncü, H., Hijikata, K. (eds) Cooling of Electronic Systems. NATO ASI Series, vol 258. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-1090-7_17
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DOI: https://doi.org/10.1007/978-94-011-1090-7_17
Publisher Name: Springer, Dordrecht
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