Abstract
An approach to the thermal design of electronic equipment is presented. Although recent progress in computer technology has enabled a complex analysis to be done, it is difficult to carry out numerical analysis for a practical electronic equipment cabinet. It has thus become important to set up an analytical model in order to apply computer simulation to the thermal design of electronic equipment. This paper reports on the approach based on lumped models and experimental data of the flow resistance coefficient and heat transfer coefficients. Simulation was carried out for a laptop computer and a copy machine by use of a personal computer and a flow visualization. The proposed method is proven to serve thermal designers satisfactorily.
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© 1994 Springer Science+Business Media Dordrecht
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Ishizuka, M. (1994). A Thermal Design Approach for Electronic Equipment by Use of a Personal Computer and Flow Visualization. In: Kakaç, S., Yüncü, H., Hijikata, K. (eds) Cooling of Electronic Systems. NATO ASI Series, vol 258. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-1090-7_15
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DOI: https://doi.org/10.1007/978-94-011-1090-7_15
Publisher Name: Springer, Dordrecht
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