Abstract
Cooling requirements in microelectronics are among the toughest barriers of to develop faster, smaller, and still more reliable systems. During the Institute, studies and review of papers on forced and natural air convection and liquid cooling (direct and indirect) were presented. This Institute also address the need for further research on the heat transfer in electronics. It is aimed to introduce various cooling methods in electronics and to compare the advantages and disadvantages of various cooling techniques to see the extend to which the designer can depend on them in the future.
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References
Nakayama, W., Thermal Management of Electronic Equipment: A Review of Technology and Research Topics, in Advances in Thermal Modeling of Electronic Components and Systems. Vol. 1, Eds. A Bar-Cohen and A. D. Kraus, Hemisphere, New York, 1988.
Chu, R. C, Heat Transfer in Electronic Equipment, Proceeding of the 8th International Heat Conference. Eds. Tien, C.L., Carey, V. P., and Ferrell, Vol. 1, pp. 293–305, Hemisphere, New York, 1986.
Ogiso, K., Recent Trends in Electronic Equipment, Heat Transfer in High Technology and Power Engineering . Eds. Yang, W. J., and Mori, Y., Hemisphere, New York, 1987.
Chu, R. C, and Simons, R. E., Heat Transfer in Electronic Equipment, Heat Transfer in High Technology and Power Engineering. Eds, Yang, W. J., and Mori, Y., Hemisphere, New York, 1987.
Moffat, R. J., Air Cooling of Electronic Components in Advances in Thermal Modeling of Electronic Components and Systems. Volume 1, Eds. A. Bar-Cohen and A. D. Kraus, Hemisphere, New York, 1988.
Ortega, A., Natural Convection Cooling of Electronic Components, in Advances in Thermal Modeling of Electronic Components and Systems. Vol. 1, Eds. A. Bar-Cohen and A. D. Kraus, Hemisphere, New York, 1988.
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© 1994 Springer Science+Business Media Dordrecht
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kakaç, S. (1994). Introduction to ASI on Cooling of Electronic Systems. In: Kakaç, S., Yüncü, H., Hijikata, K. (eds) Cooling of Electronic Systems. NATO ASI Series, vol 258. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-1090-7_1
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DOI: https://doi.org/10.1007/978-94-011-1090-7_1
Publisher Name: Springer, Dordrecht
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