Skip to main content
SpringerLink
Log in
Book cover

Micro Total Analysis Systems pp 165–179Cite as

Bonding and Assembling Methods for Realising a µTAS

  • Conference paper

Abstract

Bonding and assembly methods for realising a µTAS are summarised. A multi-level stack of wafers on which functional devices are formed is a useful structure to construct a sophisticated µTAS. Glass-silicon stacks fabricated by an anodic bonding have been widely used for micro flow control devices and systems. Bending of the glass-silicon structure sometimes observed prevents subsequent bonding. The reasons of this problem were studied to realise multi-level glass-silicon stacks. The anodic bonding using intermediate glass thin layer was also very useful for constructing silicon stacks. The required condition and the mechanism of this bonding were studied. A microconnector and a separable channel type microvalve useful in a µTAS are also described.

This is a preview of subscription content, log in via an institution.

Chapter
USD   29.95
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
eBook
USD   39.99
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book
USD   54.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Purchases are for personal use only

Learn about institutional subscriptions

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

References

  1. M.Esashi, Integrated micro flow control systems, Sensors& Actuators, A21-A23, (1990), 161–167

    Article  Google Scholar 

  2. S.Nakagawa, S.Shoji and M.Esashi, A micro chemical analyzing systemintegrated on a silicon wafer,Proc. of IEEE-MEMS Workshop, (1990-2), 89–94

    Google Scholar 

  3. M.J.Zdeblick, R.Anderson, J.Jankowski, B.Kline-Schoder, L.Christel, R.Miles andW.Weber, Thermpneumatically actuated microvalves and integrated electro-fluidiccircuits, Tech. Digest of IEEE Solid-State Sensors and Actuator Workshop, (1994-6),251–255

    Google Scholar 

  4. S.Shoji, M.Esashi,, Micromachining for chemical sensors, Chemical SensorTechnology, 1, (1988), 179–193

    CAS  Google Scholar 

  5. H.T.G.van Lintel,, F.C.M.van de Pol and S.Bouwstra, A piezoelectric micropump based onmicromaching ofsilicon, Sensors & Actuators, 15, (1988), 153–167

    Article  Google Scholar 

  6. S.Shoji, S.Nakagawa and M.Esashi, Micropump and sample-injector for integrated chemical analyzing systems, Sensors& Actuators, A21-A23, (1990), 189–192

    Article  Google Scholar 

  7. T.S.J.Lammerink, M.Elwenspoek and J.H.J.Fluitman, Integratedmicro-liquid dosing system, Proc. of IEEE-MEMS Workshop, (1993-2), 254–259

    Google Scholar 

  8. J.G.Smits, Piezoelectric micropump with three valve working peristaltically, Sensors & Actuators, A21-A23, (1990),203–206

    Google Scholar 

  9. M.Shikida and K.Sato, Characteristics of an electrostatically-drivengas valve under high-pressure conditions, Proc. of IEEE-MEMS Workshop, (1994-1),235–240

    Google Scholar 

  10. H.Mizoguchi,M.Ando, T.Mizuno, T.Takagi and N.Nakajima, Design and fabrication of light drivenmicropump,Proc.of IEEE-MEMS Workshop, (1992-2), 31–36

    Google Scholar 

  11. M. A.Hufif, J.R.Gilbert and M. A Schmidt, Flow characteristics of a pressure-balanced microvalve,Tech. Dig.of Transducers’93, (1993-6), 98–101

    Google Scholar 

  12. H.Jerman, Electrically-activated, micromachined diaphragm valves, Tech.Dig. IEEE, Sensors & ActuatorsWorkshop, (1990-6), 65–69

    Google Scholar 

  13. D.Bosch, B.Heimhofer, G.Muck, H.Seidel, U.Thumser and W. Weiser, A silicon microvalve with combined electromagnetic/electrostatic actuation, Sensors &Actuators A, 37-38, (1993), 684–692

    Article  Google Scholar 

  14. R.Zengerle, W.Geigel, A Richter, Y.Ulrich,S.Kliige and A Richter, Application of micro diaphragm pumps in microfluid systems, Aktuator94, (1994)

    Google Scholar 

  15. E.Stemme and G.Stemme, A novel piezoelectric valve-lessfluid pump, Tech. Dig. of Transducers’93, (1993-6), 110–113

    Google Scholar 

  16. S.Shoji, van der B.H.van der Schoot, N.F.de Rooij andM.Esashi, Smallest dead volume microvalves for integrated chemical analyzingsystems, Tech. Dig. of Transducers’91, (1991-6), 1052–1055

    Google Scholar 

  17. R.Rapp, W.K.Schomburg, D.Maas, J.Schulz, W.Stark, LIGAMicropump for gases and liquids, Sensors & ActuatorsA, 40, (1994), 57–61

    Article  CAS  Google Scholar 

  18. S.C.Terry, J.H.Jerman and J.B.Angell, A gas chromatographic air analyzerfabricated on a silicon wafer,IEEE, Trans. Electron Device, ED-26, (1979), 1880–1886

    Article  Google Scholar 

  19. V.Gass, B.H.van der Schoot and N.F.de Rooij, Integrated flow-regurated silicon micropump, Sensors & Actuators A, 43,(1994), 335–338

    Article  Google Scholar 

  20. E.Verpoorte, A-Manz, H.M.Widmer, B.H.van der Schoot and N.F.de Rooij, A three-dimensional micro flow system for a multi-step chemical analysis, Tech. Dig.ofTransducers’93, (1993-6), 939–942

    Google Scholar 

  21. S.Shoji and M.Esashi, Micro flow cell for blood gas analysis realizingvery small sample volume, Sensors & Actuators B, 8, (1992), 205–208

    Article  Google Scholar 

  22. C.D.Fung,P.W.Cheung, W.H.Ko and D.G.Fleming, Micromachining and micropackageing oftransducers, Elsevier Science Publishers B. V., Amsterdam, (1985), 41-61

    Google Scholar 

  23. T. A. Knecht, Bondingtechniques for solid state pressure sensors, the 4th Int. Conf. on Solid-stateSensors and Actuators, (1987-6), 95–98

    Google Scholar 

  24. H.J.Quezer, W.Benecke and C.Dell, Low temperature wafer bonding formicromechanical applications, Proc. IEEE-MEMS Workshop, (1992-2), 49–55

    Google Scholar 

  25. L. A.Field and R.S.Muller, Fusing silicon wafers with low melting temperature glass, Sensors &actuators, A21–23,(1990), 935-938

    Google Scholar 

  26. M.A Schmidt, Silicon wafer bonding for micromechanical devices, Tech.Digest of IEEE Solid-State Sensors and Actuator Workshop, (1994-6), 127–131

    Google Scholar 

  27. D.Sobek, S.D.Senturia and M.L.Gray, Microfabricated fused silica flow chambers for flow cytometry, Tech.Digest of IEEE Solid-State Sensors and Actuator Workshop, (1994-6), 260–263

    Google Scholar 

  28. M.Harz, Anodic bonding for the third dimension, J.Micromech. Microeng. 2, (1992), 161–163

    Article  CAS  Google Scholar 

  29. T.Rogers, Considerations of anodic bonding for capacitive typesilicon/glass sensor fabrication, J. Micromech. Microeng. 2, (1992),164–166

    Article  CAS  Google Scholar 

  30. T.A.Anthony,Dielectric isolation of silicon by anodic bonding, J. Appl. Phys. 58, 3,(1985), 1240–1247

    Article  CAS  Google Scholar 

  31. A-Hanneborg, M.Nese and P.Ohlckers, Silicon-to-silicon anodic bonding,Pro. of MME’90, Tech. Dig., (1990), 100–107

    Google Scholar 

  32. M.Esashi, ANakano, S.Shoji and H.Hebiguchi, Low-temperaturesilicon-to-silicon anodic bonding with intermediate lowmelting point glass, Sensors & actuators, A21-23, (1990), 931–934

    Google Scholar 

  33. M.Esashi, S.Shoji and A.Nakano, Normally closedmicrovalve and micropump fabricated on asilicon wafer,Sensors & Actuators, 20, (1989), 163–167.

    Article  Google Scholar 

  34. S.Shoji,M.Esashi, N.F.de Rooij and B.H.van der Schoot, Micro flow control devices forintegrated medical and chemical analyzingsystems, Proc. of IMACS/SICE Int. Symp. on Robotics, Mechatronics and ManufacturingSystems’92, (1992-9), 617–622

    Google Scholar 

Download references

Author information

Authors and Affiliations

  1. Department of Electronic and Communication Engineering, Waseda University, 3-4-1 Ohkubo, Shinjuku-ku, Tokyo, 169, Japan

    Shuichi Shoji

  2. Department of Mechatronics and Precision Engineering, Tohoku University, Aza Aoba, Aramaki, Aoba-ku, Sendai, 980, Japan

    Masayoshi Esashi

Authors
  1. Shuichi Shoji
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Masayoshi Esashi
    View author publications

    You can also search for this author in PubMed Google Scholar

Editor information

Editors and Affiliations

  1. MESA Research Institute, University of Twente, The Netherlands

    A. Van den Berg  & P. Bergveld  & 

Rights and permissions

Reprints and permissions

Copyright information

© 1995 Springer Science+Business Media Dordrecht

About this paper

Cite this paper

Shoji, S., Esashi, M. (1995). Bonding and Assembling Methods for Realising a µTAS. In: Van den Berg, A., Bergveld, P. (eds) Micro Total Analysis Systems. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-0161-5_16

Download citation

  • DOI: https://doi.org/10.1007/978-94-011-0161-5_16

  • Publisher Name: Springer, Dordrecht

  • Print ISBN: 978-94-010-4072-3

  • Online ISBN: 978-94-011-0161-5

  • eBook Packages: Springer Book Archive

Publish with us

Policies and ethics

Search

Navigation