Abstract
Silicon-on-Insulator (SoI) technology offers an advanced electronic material structure suitable for realisation of a high performance bipolar transistor (BT). In this work, we demonstrate a route to a high performance thin-film BT on SoI fabricated using Sol-CMOS process for future thin-film SoI-BiCMOS circuits. The proposed novel approach to a thin-film BT has a device structure with a highly efficient Top poly-silicon Emitter and a low resistance N+ Side-Collector (TESC). An npn TESC-BT was fabricated on an 85nm thinned silicon overlayer of SIMOX material. Good common-emitter output characteristics of the npn TESC-BT were obtained, demonstrating the viable underlying concept of a TESC approach for a bipolar transistor fabricated on thin-film SoI substrate. The evaluated lateral pinched base resistance of 4kΩ for a 20µm long TESC device is reflected in the collector current role-off at a very high current density (6000Acm−2). A reduction in the base Gummel number, as a consequence of back-gate biasing the TESC device dramatically enhances the current gain and induces drift current favourable for achieving higher ft. Under such baising conditions or with a suitable doping profile, a 2-dimensional bipolar operation can occur. The TESC device offers the potential for realising vertical bipolar operation in a very thin-film silicon overlayer by inverting the back-interface, which acts as an extended side collector, thus improving the collecting efficiency. The TESC approach to bipolar transistor in a thin-film SoI was found to be a versatile device which can sustain, both the lateral and vertical bipolar operation.
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© 1995 Springer Science+Business Media Dordrecht
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Patel, C.J., Jankovic, N.D., Colinge, JP. (1995). Novel TESC Bipolar Transistor Approach for a Thin-Film Silicon-On-Insulator Substrate. In: Colinge, J.P., Lysenko, V.S., Nazarov, A.N. (eds) Physical and Technical Problems of SOI Structures and Devices. NATO ASI Series, vol 4. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-0109-7_19
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DOI: https://doi.org/10.1007/978-94-011-0109-7_19
Publisher Name: Springer, Dordrecht
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