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Polyimides for semiconductor applications

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Polyimides

Abstract

A wide variety of polymeric materials are used in the manufacture of semiconductor devices. Examples include polymers for use as photoresists in microfabrication and epoxy moulding compounds used in electronic packaging.

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References

  1. K. Mukai, A. Saiki, IEEE J. Solid-State Circuits SC-13 (1978) 462.

    Google Scholar 

  2. K. Sato, S. Harada, IEEE Trans, Hybrid and Packaging PHP-176 (1973).

    Google Scholar 

  3. Hitachi Chemical Catalogue (Technical Data Sheet of Hitachi Chemical).

    Google Scholar 

  4. Technical data sheet of the corresponding company.

    Google Scholar 

  5. Ibid.

    Google Scholar 

  6. Ibid.

    Google Scholar 

  7. Science Forum, VLSI Process Data (1982) 286.

    Google Scholar 

  8. A. Saiki, K. Mukai, Proceedings of Polymer Materials for Electronic Application, 180th ACS National Meeting (1980) 123.

    Google Scholar 

  9. L.B. Lothman, J. Electrochem. Soc. Solid State Science and Technology 127 (1980) 2216.

    Google Scholar 

  10. A. Saiki, S. Harada, Proceedings of IECE of Japan (1977) no. 91.

    Google Scholar 

  11. Technical data sheet of Hitachi Chemical.

    Google Scholar 

  12. K. Mukai and H. Harada, Proceedings of IECE of Japan (1975) no. 377.

    Google Scholar 

  13. A. Saiki, S. Harada, J. Electrochem. Soc. 129 (1982) 2278.

    Article  Google Scholar 

  14. G.A. Brown, 180th ACS Meeting (1980) 476.

    Google Scholar 

  15. T. Nishida, A. Saiki in, Polyimides, Vol. 2, Plenum Publishing Corp. (1984) 827.

    Google Scholar 

  16. T. Nishida, A. Saiki, Proceedings of IEDM 82 (1982) 552.

    Google Scholar 

  17. F. Syoji and F. Kataoka, Electronic materials of Japan, 7 (1983) 30.

    Google Scholar 

  18. T. Nishida, K. Mukai, Proceedings of Int. Rel. Phys. Symp., Florida (1985).

    Google Scholar 

  19. R.W. Wu, IEEE VLSI Multilevel Interconnection Conf. (1987) 15.

    Google Scholar 

  20. Y. Misawa, N. Kinjo, IEEE Symposium of VLSI’ Technology (1986).

    Google Scholar 

  21. K. Kitade, S. Koyama, Proceedings of IECE of Japan (1981) no. 63.

    Google Scholar 

  22. W. Sasaki, K. Serizawa, Proceedings of 34th Electronic Components Conf. (1984) 383.

    Google Scholar 

  23. H. Matsumoto, M. Tanada, 1985 Symposium on VLSI Technology (1985) VIII-3.

    Google Scholar 

  24. S. Numata, K. Kinjo, Proceedings of 2nd Int. Conf. on Polyimides (1987) 492.

    Google Scholar 

  25. H. Suzuki, H. Sekine, Proceedings of 2nd Int. Conf. on Polyimides (1987) 560.

    Google Scholar 

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© 1990 Springer Science+Business Media New York

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Satou, H., Suzuki, H., Makino, D. (1990). Polyimides for semiconductor applications. In: Wilson, D., Stenzenberger, H.D., Hergenrother, P.M. (eds) Polyimides. Springer, Dordrecht. https://doi.org/10.1007/978-94-010-9661-4_8

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  • DOI: https://doi.org/10.1007/978-94-010-9661-4_8

  • Publisher Name: Springer, Dordrecht

  • Print ISBN: 978-94-010-9663-8

  • Online ISBN: 978-94-010-9661-4

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