Abstract
BS6138 describes a holt-melt adhesive as a thermoplastic adhesive that is applied in the molten state and forms a bond on cooling to a solid state. The adhesive usually melts between 100°C, the lowest practical temperature to achieve a final bonded product to resist moderate warmth, to 200°C where the application temperature, usually about 40°C above this melting point, is reaching the decomposition point of the adhesive and probably the substrate as well.
This is a preview of subscription content, log in via an institution.
Buying options
Tax calculation will be finalised at checkout
Purchases are for personal use only
Learn about institutional subscriptionsPreview
Unable to display preview. Download preview PDF.
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 1989 Elsevier Science Publishers Ltd
About this chapter
Cite this chapter
Agger, R.T. (1989). The Current Situation for Holt-Melt Adhesives. In: Allen, K.W. (eds) Adhesion 13. Springer, Dordrecht. https://doi.org/10.1007/978-94-010-9082-7_7
Download citation
DOI: https://doi.org/10.1007/978-94-010-9082-7_7
Publisher Name: Springer, Dordrecht
Print ISBN: 978-94-010-9084-1
Online ISBN: 978-94-010-9082-7
eBook Packages: Springer Book Archive