Abstract
Performance of many high-accuracy (electronic) applications is reduced by thermal fluctuations within the application. The simplest and most common technique to reduce those effects is compensation, e.g. by dynamic element matching [1]. Although such techniques can significantly reduce the effect of fluctuations, they do not remove the error source, which is still preferable from a viewpoint of metrology.
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© 2001 Springer Science+Business Media Dordrecht
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Wijngaards, D.D.L., de Graaf, G., Kong, S.H., Wolffenbuttel, R.F. (2001). Study on the Behaviour of Various Substrate Geometries for Use As Passive Heat Sink. In: Elwenspoek, M. (eds) Sensor Technology 2001. Springer, Dordrecht. https://doi.org/10.1007/978-94-010-0840-2_9
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DOI: https://doi.org/10.1007/978-94-010-0840-2_9
Publisher Name: Springer, Dordrecht
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