Abstract
Effect of annealing at up to 1400 K under argon pressure up to 1.2 GPa on hydrogen — plasma — etched and hydrogen — implanted Czochralski or FZ silicon was investigated by SIMS, X — ray, TEM, electrical, infrared and photoluminescence methods.
External stress during annealing of hydrogen — containing Si results in suppression of hydrogen out — diffusion but in its pronounced diffusion into sample depth, in stress — stimulated creation of small bubbles, thermal donors and crystallographic defects but in preventing of sample splitting.
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Abbreviations
- co :
-
concentration of oxygen in interstitial positions
- CVD:
-
chemical vapour deposition
- Cz-Si:
-
Czochralski - grown single crystalline silicon
- d:
-
distance between crystallographic planes
- D:
-
hydrogen dose in hydrogen - implanted Si:H samples
- FZ-Si:
-
floating zone grown single crystalline silicon
- HP:
-
enhanced (high) hydrostatic pressure
- HPE-Si:
-
hydrogen - plasma etched silicon
- HT - HP:
-
treatment (annealing) at HP
- IR:
-
infrared absorption (measurement)
- PL:
-
photoluminescence
- Si:H:
-
hydrogen - implanted silicon
- SIMS:
-
secondary ions mass spectrometry
- SOl:
-
silicon on insulator (Si / Si02 / Si) structure
- TEM:
-
transmission electron microscopy
- λ:
-
X - ray wavelength
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Misiuk, A. et al. (2002). Effect of Annealing at Argon Pressure Up to 1.2 GPa on Hydrogen — Plasma Etched and Hydrogen — Implanted Single — Crystalline Silicon. In: Hampton, M.D., Schur, D.V., Zaginaichenko, S.Y., Trefilov, V.I. (eds) Hydrogen Materials Science and Chemistry of Metal Hydrides. NATO Science Series, vol 71. Springer, Dordrecht. https://doi.org/10.1007/978-94-010-0558-6_43
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DOI: https://doi.org/10.1007/978-94-010-0558-6_43
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