Abstract
Metallic thin films are deposited with electroplating and electroless processes by electrolysis: metallic ions in an aqueous solution are reduced to metal atoms.
This is a preview of subscription content, log in via an institution to check access.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
References
Mattsson. E. and Bockris, J. O’ M, (1959), Kinetics of copper electrodeposition, Trans. Faraday Soc., 55. 1586.
Wagner, C. (1951), Theoretical analysis of the current density distribution in electrolytic cells, J. Electroch. Soc., 98. 116–128.
Andncacos, P.C., Uzoh, C., Dukovic, J.O., Horkans, J. and Deligianni, (1998), Damascene copper electroplating for chip interconnections, IBMJ. of Research & Development, 42, 567.
Nelissen. G., Theemsche, van, A., Lecho, S. and Deconinck, J., (2000), Beherrschung der Schichtdicken-Verteilungen. Galvanotechnik, 4, 970–979.
Ruythooren, W., Attenborough, K., Beerten, S., Merken, P., Fransaer, J., Beyne, E., Van Hoof, C., De Boeck, J and Celis, J. P. (1999) Electrodeposition for the synthesis of microsystems, Proceedings of Micromechanics Europe., 16–23.
Gemmler, A. and Richter H. (1999) Präzisionsgalvanik für die Mikroelektronik, Galvanotechnik, 12, 3282
Daenen, T.E.G., (2000), Plating on Ceramics, Galvanotechnik, 4, 966
Daenen, T.E.G., Messing, W., Hout, v.d., M., Loenen, v., E.J. and Bossche, v.d., B (1999), A new approach for the manufacture of miniaturized pattern-coils, Plating & Surface Finishing, 3, 78–82.
Romankiw, L.T. (1997), Review: Form electroplating through lithographic masks in electronics to LIGA in MEMS, Electrochemica Acta, 42, 2985–3005.
Jacobs, J.W.M and Rikken, J. M.G., (1988), Oxygen-diffusion-size effect in electroless metal deposition, J. Electrochem. Soc., 135, 2822–2827.
Thies, A., Schanz, G., Walch, E. and Konys, J., (1997) Chemical deposition of metals for the formation of microstructures, Electrochemica Acta, 42, 3033–3040.
Putten, van der, A.M.T. and de Bakker, de, J.W.G., (1993), Geometrical effects in the electroless metalization of fine metal patterns, J. Electrochem. Soc., 140, 2221.
Watanabe, H. and Honma, H., (1997), Fabrication of nickel microbump on aluminium using electroless nickel plating, J. Electrochem. Soc., 144, 471
Homma, T., Sezai, Y and Osaka, T. (1997) A study on growth processes of CoNiP perpendicular magnetic anisotropy films electroless deposited at room temperature, Electrochemica Acta, 42, 3041–3047.
Lowenheim, F.A. (1974) Modern Electroplating, John Wiley, New York.
Antropov, L. I. (1977) Theoretical Electrochemistry, Mir publishers, Moskow.
Budevski, E., Staikov, G. and Lorenz, W.J. (1996) Electrochemical Phase Formation and Growth, VHC, Weinheim.
Madou, M. (1997) Fundamentals of Microfabrication, CRC Press, New York.
Brenner, A. (1963) Electrodeposition of Alloys I +II, Academic Press, New York.
Mallory, G. and Hadju, J.B. (1990) Electroless Plating: Fundamentals & Applications, AESF Orlando, Florida.
Paunovic, M. and Schesinger, M. (1998) Fundamentals of Electrochemical Deposition, John Wiley, New York.
Bard, A. J. (1973) Encyclopaedia of Electrochemistry of the Elements, Marcel Dekker inc., New York.
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2002 Springer Science+Business Media Dordrecht
About this chapter
Cite this chapter
Daenen, T.E.G., De Kubber, D.L. (2002). Electroplating and Electroless Deposition Processes for Electronic Components and Microsystems. In: Pauleau, Y. (eds) Chemical Physics of Thin Film Deposition Processes for Micro- and Nano-Technologies. NATO Science Series, vol 55. Springer, Dordrecht. https://doi.org/10.1007/978-94-010-0353-7_1
Download citation
DOI: https://doi.org/10.1007/978-94-010-0353-7_1
Publisher Name: Springer, Dordrecht
Print ISBN: 978-1-4020-0525-1
Online ISBN: 978-94-010-0353-7
eBook Packages: Springer Book Archive