Abstract
The field reliability of an electronic component - the probability of its survival over a stipulated period of service - is determined by the standards applied to its design, the control exercised over its manufacture, and the efficiency of any screening and batch-acceptance procedures which may be applied prior to its deployment. These topics have received intensive study in modern times yielding, for components of broadly comparable functional performance, (both active and passive) steadily improving reliability. Whilst this trend can be expected to continue, it can confidently be asserted that there will always be a need for reliability measurements. The component designer may wish to assess the elements of his component, a metallisation track, a transistor say, as a prior activity. The equipment maker or the equipment operator may decide to assess the reliability of a desired component type-code before its commitment, and in the production phase, they may need to identify burn-in treatments and the details of sampling tests. In the field, component reliability information is needed for such purposes as equipment design evaluation and spares and maintenance provisioning, and sometimes just for publication as a straightforward historical record.
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© 1982 Martinus Nijhoff Publishers, The Hague
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Reynolds, F.H. (1982). Semiconductor Component Accelerated Testing and Data Analysis. In: Esaki, L., Soncini, G. (eds) Large Scale Integrated Circuits Technology: State of the Art and Prospects. NATO Advanced Study Institutes Series, vol 55. Springer, Dordrecht. https://doi.org/10.1007/978-94-009-7645-0_18
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DOI: https://doi.org/10.1007/978-94-009-7645-0_18
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