Abstract
A thorough study of the fracture behaviour of a bimaterial plate with a crack along the interface was undertaken. The plate was subjected to a uniform normal stress at infinity, while its two phases were perfectly bonded along the interface. The angle of initial crack propagation into either of the two phases and the corresponding critical failure loads were determined for many material combinations of the plate by using the strain energy density criterion proposed by Sih. Finally, the fracture trajectories from the crack tip for conditions of unstable fracture were determined.
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References
Six, G. C., Strain-energy-density factor applied to mixed mode crack problems, Int. J. Fract., 10 (1974), 305–321.
Gdoutos, E. E., Mixed-Mode Crack Growth (ed. G. C. Sih), Martinus Nijhoff (in press).
Erdogan, F., Stress distribution in bonded dissimilar materials with cracks, ASME Trans., J. appl. Mech., 32 (1965), 403–410.
Rice, J. R. and Six, G. C., Plane problems of cracks in dissimilar media, ASME Trans., J. appl. Mech., 32 (1965), 418–423.
Williams, M. L., The stresses around a fault or crack in dissimilar media. Bull. Seism. Soc. Amer., 49 (1959), 199–204.
Wang, T. T., Kwei, T. K. and Zupko, H. M., Tensile strength of butt joined epoxy-aluminum plates. Int. J. Fract. Mech., 6 (1970), 127–137.
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© 1983 Applied Science Publishers Ltd
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Gdoutos, E.E. (1983). Fracture of a Bimaterial Plate with a Crack along the Interface. In: Marshall, I.H. (eds) Composite Structures 2. Springer, Dordrecht. https://doi.org/10.1007/978-94-009-6640-6_35
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DOI: https://doi.org/10.1007/978-94-009-6640-6_35
Publisher Name: Springer, Dordrecht
Print ISBN: 978-94-009-6642-0
Online ISBN: 978-94-009-6640-6
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