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Plastic Encapsulated Device Reliability

Chapter

Abstract

The introduction of planar technology in 1959 dramatically reduced the price of semiconductor components and, as a result, encapsulation costs became a significant proportion of the total. At that time most components were hermetically packaged, but by 1962 the pressures to make some high-volume production items less expensive led to the development of plastic encapsulation. Since then the use of plastic encapsulation has increased to the extent that over 90% of all semiconductor products are now supplied in this form.

Keywords

Alpha Particle Passivation Layer Ionic Impurity Surface Conductivity Thermal Cycling Test 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Elsevier Applied Science Publishers Ltd. 1985

Authors and Affiliations

  1. 1.British Telecom Research LaboratoriesIpswichUK

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