Plastic Encapsulated Device Reliability
- 115 Downloads
The introduction of planar technology in 1959 dramatically reduced the price of semiconductor components and, as a result, encapsulation costs became a significant proportion of the total. At that time most components were hermetically packaged, but by 1962 the pressures to make some high-volume production items less expensive led to the development of plastic encapsulation. Since then the use of plastic encapsulation has increased to the extent that over 90% of all semiconductor products are now supplied in this form.
KeywordsAlpha Particle Passivation Layer Ionic Impurity Surface Conductivity Thermal Cycling Test
Unable to display preview. Download preview PDF.
- 5.Gale, R. J., Epoxy degradation induced Au-Al intermetallic void formation in plastic encapsulated MOS memories,Reliability Physics Symposium Proceedings,22(1984) 37.Google Scholar
- 6.Schroen, W. H., Spencer, J. L., Bryan, J. A., Cleveland, R. D., Metzgar, T. D. and Edwards, D. R, Reliability tests and stress in plastic encapsulated circuits,Reliability Physics Symposium Proceedings,19(1981) 81.Google Scholar
- 7.Ubbing, J., Mechanisms of temperature cycle failure in encapsulated optoelectronic devices,Reliability Physics Symposium Proceedings,19(1981) 149.Google Scholar
- 9.Sim, S. P. and Lawson, R. W., The influence of plastic encapsulants and passivation layers on the corrosion of thin aluminium films subjected to humidity stress,Reliability Physics Symposium Proceedings,17(1979) 103.Google Scholar
- 10.Lawson, R. W., The accelerated testing of plastic encapsulated semiconductor components,Reliability Physics Symposium Proceedings,12(1974) 243 – 9.Google Scholar
- 11.Lawson, R. W., A review of the status of plastic encapsulated semiconductor component reliability,British Telecom Technol. J.,2(1984) 95.Google Scholar
- 12.Sbar, N. L. and Kozakiewicz, R. P., New acceleration factors for temperature, humidity, bias testing,IEEE Trans. Electron Devices,ED-26(1979) 56.Google Scholar
- 13.Merrett, R. P., Bryant, J. P. and Studd, R., An appraisal of high temperature humidity stress tests for assessing plastic encapsulated semiconductor components,Reliability Physics Symposium Proceedings,21(1983) 73.Google Scholar