Plastic Encapsulated Device Reliability



The introduction of planar technology in 1959 dramatically reduced the price of semiconductor components and, as a result, encapsulation costs became a significant proportion of the total. At that time most components were hermetically packaged, but by 1962 the pressures to make some high-volume production items less expensive led to the development of plastic encapsulation. Since then the use of plastic encapsulation has increased to the extent that over 90% of all semiconductor products are now supplied in this form.


Alpha Particle Passivation Layer Ionic Impurity Surface Conductivity Thermal Cycling Test 
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Copyright information

© Elsevier Applied Science Publishers Ltd. 1985

Authors and Affiliations

  1. 1.British Telecom Research LaboratoriesIpswichUK

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